Electronics & Semiconductor
Global Semiconductor & IC Packaging Materials Market Research Report 2024
- Sep 18, 24
- ID: 239764
- Pages: 140
- Figures: 139
- Views: 7
Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards. Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile.
The global Semiconductor & IC Packaging Materials market was valued at US$ 25200 million in 2023 and is anticipated to reach US$ 36000 million by 2030, witnessing a CAGR of 5.3% during the forecast period 2024-2030.
North American market for Semiconductor & IC Packaging Materials is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Semiconductor & IC Packaging Materials is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Semiconductor & IC Packaging Materials in Automobile Industry is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Semiconductor & IC Packaging Materials include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, Toppan, Zhen Ding Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Semiconductor & IC Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor & IC Packaging Materials.
The Semiconductor & IC Packaging Materials market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor & IC Packaging Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor & IC Packaging Materials companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Samsung Electro-Mechanics
Kyocera
Toppan
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Mitsui High-tec
Henkel
Chang Wah Technology
Advanced Assembly Materials International
HAESUNG DS
Fusheng Electronics
Enomoto
Kangqiang
POSSEHL
JIH LIN TECHNOLOGY
Hualong
Dynacraft Industries
QPL Limited
WUXI HUAJING LEADFRAME
HUAYANG ELECTRONIC
DNP
Xiamen Jsun Precision Technology
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
KCC
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Hysolem
Segment by Type
IC Substrates
Bonding Wires
Lead Frames
Gold Wire & Copper Wire
Compound
Ceramic packaging materials
Die Attach Materials
Others
Segment by Application
Automobile Industry
Electronics Industry
Communication
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor & IC Packaging Materials company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
The global Semiconductor & IC Packaging Materials market was valued at US$ 25200 million in 2023 and is anticipated to reach US$ 36000 million by 2030, witnessing a CAGR of 5.3% during the forecast period 2024-2030.
North American market for Semiconductor & IC Packaging Materials is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Semiconductor & IC Packaging Materials is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Semiconductor & IC Packaging Materials in Automobile Industry is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Semiconductor & IC Packaging Materials include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, Toppan, Zhen Ding Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Semiconductor & IC Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor & IC Packaging Materials.
The Semiconductor & IC Packaging Materials market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor & IC Packaging Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor & IC Packaging Materials companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Samsung Electro-Mechanics
Kyocera
Toppan
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Mitsui High-tec
Henkel
Chang Wah Technology
Advanced Assembly Materials International
HAESUNG DS
Fusheng Electronics
Enomoto
Kangqiang
POSSEHL
JIH LIN TECHNOLOGY
Hualong
Dynacraft Industries
QPL Limited
WUXI HUAJING LEADFRAME
HUAYANG ELECTRONIC
DNP
Xiamen Jsun Precision Technology
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
KCC
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Hysolem
Segment by Type
IC Substrates
Bonding Wires
Lead Frames
Gold Wire & Copper Wire
Compound
Ceramic packaging materials
Die Attach Materials
Others
Segment by Application
Automobile Industry
Electronics Industry
Communication
Other
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor & IC Packaging Materials company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor & IC Packaging Materials Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IC Substrates
1.2.3 Bonding Wires
1.2.4 Lead Frames
1.2.5 Gold Wire & Copper Wire
1.2.6 Compound
1.2.7 Ceramic packaging materials
1.2.8 Die Attach Materials
1.2.9 Others
1.3 Market by Application
1.3.1 Global Semiconductor & IC Packaging Materials Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automobile Industry
1.3.3 Electronics Industry
1.3.4 Communication
1.3.5 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor & IC Packaging Materials Market Perspective (2019-2030)
2.2 Global Semiconductor & IC Packaging Materials Growth Trends by Region
2.2.1 Global Semiconductor & IC Packaging Materials Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor & IC Packaging Materials Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor & IC Packaging Materials Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor & IC Packaging Materials Market Dynamics
2.3.1 Semiconductor & IC Packaging Materials Industry Trends
2.3.2 Semiconductor & IC Packaging Materials Market Drivers
2.3.3 Semiconductor & IC Packaging Materials Market Challenges
2.3.4 Semiconductor & IC Packaging Materials Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor & IC Packaging Materials Players by Revenue
3.1.1 Global Top Semiconductor & IC Packaging Materials Players by Revenue (2019-2024)
3.1.2 Global Semiconductor & IC Packaging Materials Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor & IC Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Semiconductor & IC Packaging Materials Revenue
3.4 Global Semiconductor & IC Packaging Materials Market Concentration Ratio
3.4.1 Global Semiconductor & IC Packaging Materials Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor & IC Packaging Materials Revenue in 2023
3.5 Global Key Players of Semiconductor & IC Packaging Materials Head office and Area Served
3.6 Global Key Players of Semiconductor & IC Packaging Materials, Product and Application
3.7 Global Key Players of Semiconductor & IC Packaging Materials, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor & IC Packaging Materials Breakdown Data by Type
4.1 Global Semiconductor & IC Packaging Materials Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor & IC Packaging Materials Forecasted Market Size by Type (2025-2030)
5 Semiconductor & IC Packaging Materials Breakdown Data by Application
5.1 Global Semiconductor & IC Packaging Materials Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor & IC Packaging Materials Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor & IC Packaging Materials Market Size (2019-2030)
6.2 North America Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
6.4 North America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor & IC Packaging Materials Market Size (2019-2030)
7.2 Europe Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
7.4 Europe Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor & IC Packaging Materials Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor & IC Packaging Materials Market Size (2019-2030)
9.2 Latin America Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
9.4 Latin America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor & IC Packaging Materials Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Unimicron
11.1.1 Unimicron Company Details
11.1.2 Unimicron Business Overview
11.1.3 Unimicron Semiconductor & IC Packaging Materials Introduction
11.1.4 Unimicron Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.1.5 Unimicron Recent Development
11.2 Ibiden
11.2.1 Ibiden Company Details
11.2.2 Ibiden Business Overview
11.2.3 Ibiden Semiconductor & IC Packaging Materials Introduction
11.2.4 Ibiden Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.2.5 Ibiden Recent Development
11.3 Nan Ya PCB
11.3.1 Nan Ya PCB Company Details
11.3.2 Nan Ya PCB Business Overview
11.3.3 Nan Ya PCB Semiconductor & IC Packaging Materials Introduction
11.3.4 Nan Ya PCB Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.3.5 Nan Ya PCB Recent Development
11.4 Shinko Electric Industries
11.4.1 Shinko Electric Industries Company Details
11.4.2 Shinko Electric Industries Business Overview
11.4.3 Shinko Electric Industries Semiconductor & IC Packaging Materials Introduction
11.4.4 Shinko Electric Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.4.5 Shinko Electric Industries Recent Development
11.5 Kinsus Interconnect Technology
11.5.1 Kinsus Interconnect Technology Company Details
11.5.2 Kinsus Interconnect Technology Business Overview
11.5.3 Kinsus Interconnect Technology Semiconductor & IC Packaging Materials Introduction
11.5.4 Kinsus Interconnect Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.5.5 Kinsus Interconnect Technology Recent Development
11.6 AT&S
11.6.1 AT&S Company Details
11.6.2 AT&S Business Overview
11.6.3 AT&S Semiconductor & IC Packaging Materials Introduction
11.6.4 AT&S Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.6.5 AT&S Recent Development
11.7 Samsung Electro-Mechanics
11.7.1 Samsung Electro-Mechanics Company Details
11.7.2 Samsung Electro-Mechanics Business Overview
11.7.3 Samsung Electro-Mechanics Semiconductor & IC Packaging Materials Introduction
11.7.4 Samsung Electro-Mechanics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.7.5 Samsung Electro-Mechanics Recent Development
11.8 Kyocera
11.8.1 Kyocera Company Details
11.8.2 Kyocera Business Overview
11.8.3 Kyocera Semiconductor & IC Packaging Materials Introduction
11.8.4 Kyocera Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.8.5 Kyocera Recent Development
11.9 Toppan
11.9.1 Toppan Company Details
11.9.2 Toppan Business Overview
11.9.3 Toppan Semiconductor & IC Packaging Materials Introduction
11.9.4 Toppan Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.9.5 Toppan Recent Development
11.10 Zhen Ding Technology
11.10.1 Zhen Ding Technology Company Details
11.10.2 Zhen Ding Technology Business Overview
11.10.3 Zhen Ding Technology Semiconductor & IC Packaging Materials Introduction
11.10.4 Zhen Ding Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.10.5 Zhen Ding Technology Recent Development
11.11 Daeduck Electronics
11.11.1 Daeduck Electronics Company Details
11.11.2 Daeduck Electronics Business Overview
11.11.3 Daeduck Electronics Semiconductor & IC Packaging Materials Introduction
11.11.4 Daeduck Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.11.5 Daeduck Electronics Recent Development
11.12 Zhuhai Access Semiconductor
11.12.1 Zhuhai Access Semiconductor Company Details
11.12.2 Zhuhai Access Semiconductor Business Overview
11.12.3 Zhuhai Access Semiconductor Semiconductor & IC Packaging Materials Introduction
11.12.4 Zhuhai Access Semiconductor Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.12.5 Zhuhai Access Semiconductor Recent Development
11.13 LG InnoTek
11.13.1 LG InnoTek Company Details
11.13.2 LG InnoTek Business Overview
11.13.3 LG InnoTek Semiconductor & IC Packaging Materials Introduction
11.13.4 LG InnoTek Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.13.5 LG InnoTek Recent Development
11.14 Shennan Circuit
11.14.1 Shennan Circuit Company Details
11.14.2 Shennan Circuit Business Overview
11.14.3 Shennan Circuit Semiconductor & IC Packaging Materials Introduction
11.14.4 Shennan Circuit Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.14.5 Shennan Circuit Recent Development
11.15 Shenzhen Fastprint Circuit Tech
11.15.1 Shenzhen Fastprint Circuit Tech Company Details
11.15.2 Shenzhen Fastprint Circuit Tech Business Overview
11.15.3 Shenzhen Fastprint Circuit Tech Semiconductor & IC Packaging Materials Introduction
11.15.4 Shenzhen Fastprint Circuit Tech Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.15.5 Shenzhen Fastprint Circuit Tech Recent Development
11.16 Mitsui High-tec
11.16.1 Mitsui High-tec Company Details
11.16.2 Mitsui High-tec Business Overview
11.16.3 Mitsui High-tec Semiconductor & IC Packaging Materials Introduction
11.16.4 Mitsui High-tec Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.16.5 Mitsui High-tec Recent Development
11.17 Henkel
11.17.1 Henkel Company Details
11.17.2 Henkel Business Overview
11.17.3 Henkel Semiconductor & IC Packaging Materials Introduction
11.17.4 Henkel Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.17.5 Henkel Recent Development
11.18 Chang Wah Technology
11.18.1 Chang Wah Technology Company Details
11.18.2 Chang Wah Technology Business Overview
11.18.3 Chang Wah Technology Semiconductor & IC Packaging Materials Introduction
11.18.4 Chang Wah Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.18.5 Chang Wah Technology Recent Development
11.19 Advanced Assembly Materials International
11.19.1 Advanced Assembly Materials International Company Details
11.19.2 Advanced Assembly Materials International Business Overview
11.19.3 Advanced Assembly Materials International Semiconductor & IC Packaging Materials Introduction
11.19.4 Advanced Assembly Materials International Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.19.5 Advanced Assembly Materials International Recent Development
11.20 HAESUNG DS
11.20.1 HAESUNG DS Company Details
11.20.2 HAESUNG DS Business Overview
11.20.3 HAESUNG DS Semiconductor & IC Packaging Materials Introduction
11.20.4 HAESUNG DS Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.20.5 HAESUNG DS Recent Development
11.21 Fusheng Electronics
11.21.1 Fusheng Electronics Company Details
11.21.2 Fusheng Electronics Business Overview
11.21.3 Fusheng Electronics Semiconductor & IC Packaging Materials Introduction
11.21.4 Fusheng Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.21.5 Fusheng Electronics Recent Development
11.22 Enomoto
11.22.1 Enomoto Company Details
11.22.2 Enomoto Business Overview
11.22.3 Enomoto Semiconductor & IC Packaging Materials Introduction
11.22.4 Enomoto Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.22.5 Enomoto Recent Development
11.23 Kangqiang
11.23.1 Kangqiang Company Details
11.23.2 Kangqiang Business Overview
11.23.3 Kangqiang Semiconductor & IC Packaging Materials Introduction
11.23.4 Kangqiang Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.23.5 Kangqiang Recent Development
11.24 POSSEHL
11.24.1 POSSEHL Company Details
11.24.2 POSSEHL Business Overview
11.24.3 POSSEHL Semiconductor & IC Packaging Materials Introduction
11.24.4 POSSEHL Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.24.5 POSSEHL Recent Development
11.25 JIH LIN TECHNOLOGY
11.25.1 JIH LIN TECHNOLOGY Company Details
11.25.2 JIH LIN TECHNOLOGY Business Overview
11.25.3 JIH LIN TECHNOLOGY Semiconductor & IC Packaging Materials Introduction
11.25.4 JIH LIN TECHNOLOGY Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.25.5 JIH LIN TECHNOLOGY Recent Development
11.26 Hualong
11.26.1 Hualong Company Details
11.26.2 Hualong Business Overview
11.26.3 Hualong Semiconductor & IC Packaging Materials Introduction
11.26.4 Hualong Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.26.5 Hualong Recent Development
11.27 Dynacraft Industries
11.27.1 Dynacraft Industries Company Details
11.27.2 Dynacraft Industries Business Overview
11.27.3 Dynacraft Industries Semiconductor & IC Packaging Materials Introduction
11.27.4 Dynacraft Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.27.5 Dynacraft Industries Recent Development
11.28 QPL Limited
11.28.1 QPL Limited Company Details
11.28.2 QPL Limited Business Overview
11.28.3 QPL Limited Semiconductor & IC Packaging Materials Introduction
11.28.4 QPL Limited Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.28.5 QPL Limited Recent Development
11.29 WUXI HUAJING LEADFRAME
11.29.1 WUXI HUAJING LEADFRAME Company Details
11.29.2 WUXI HUAJING LEADFRAME Business Overview
11.29.3 WUXI HUAJING LEADFRAME Semiconductor & IC Packaging Materials Introduction
11.29.4 WUXI HUAJING LEADFRAME Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.29.5 WUXI HUAJING LEADFRAME Recent Development
11.30 HUAYANG ELECTRONIC
11.30.1 HUAYANG ELECTRONIC Company Details
11.30.2 HUAYANG ELECTRONIC Business Overview
11.30.3 HUAYANG ELECTRONIC Semiconductor & IC Packaging Materials Introduction
11.30.4 HUAYANG ELECTRONIC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.30.5 HUAYANG ELECTRONIC Recent Development
11.31 DNP
11.31.1 DNP Company Details
11.31.2 DNP Business Overview
11.31.3 DNP Semiconductor & IC Packaging Materials Introduction
11.31.4 DNP Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.31.5 DNP Recent Development
11.32 Xiamen Jsun Precision Technology
11.32.1 Xiamen Jsun Precision Technology Company Details
11.32.2 Xiamen Jsun Precision Technology Business Overview
11.32.3 Xiamen Jsun Precision Technology Semiconductor & IC Packaging Materials Introduction
11.32.4 Xiamen Jsun Precision Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.32.5 Xiamen Jsun Precision Technology Recent Development
11.33 Sumitomo Bakelite
11.33.1 Sumitomo Bakelite Company Details
11.33.2 Sumitomo Bakelite Business Overview
11.33.3 Sumitomo Bakelite Semiconductor & IC Packaging Materials Introduction
11.33.4 Sumitomo Bakelite Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.33.5 Sumitomo Bakelite Recent Development
11.34 Showa Denko
11.34.1 Showa Denko Company Details
11.34.2 Showa Denko Business Overview
11.34.3 Showa Denko Semiconductor & IC Packaging Materials Introduction
11.34.4 Showa Denko Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.34.5 Showa Denko Recent Development
11.35 Chang Chun Group
11.35.1 Chang Chun Group Company Details
11.35.2 Chang Chun Group Business Overview
11.35.3 Chang Chun Group Semiconductor & IC Packaging Materials Introduction
11.35.4 Chang Chun Group Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.35.5 Chang Chun Group Recent Development
11.36 Hysol Huawei Electronics
11.36.1 Hysol Huawei Electronics Company Details
11.36.2 Hysol Huawei Electronics Business Overview
11.36.3 Hysol Huawei Electronics Semiconductor & IC Packaging Materials Introduction
11.36.4 Hysol Huawei Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.36.5 Hysol Huawei Electronics Recent Development
11.37 Panasonic
11.37.1 Panasonic Company Details
11.37.2 Panasonic Business Overview
11.37.3 Panasonic Semiconductor & IC Packaging Materials Introduction
11.37.4 Panasonic Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.37.5 Panasonic Recent Development
11.38 KCC
11.38.1 KCC Company Details
11.38.2 KCC Business Overview
11.38.3 KCC Semiconductor & IC Packaging Materials Introduction
11.38.4 KCC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.38.5 KCC Recent Development
11.39 Eternal Materials
11.39.1 Eternal Materials Company Details
11.39.2 Eternal Materials Business Overview
11.39.3 Eternal Materials Semiconductor & IC Packaging Materials Introduction
11.39.4 Eternal Materials Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.39.5 Eternal Materials Recent Development
11.40 Jiangsu Zhongpeng New Material
11.40.1 Jiangsu Zhongpeng New Material Company Details
11.40.2 Jiangsu Zhongpeng New Material Business Overview
11.40.3 Jiangsu Zhongpeng New Material Semiconductor & IC Packaging Materials Introduction
11.40.4 Jiangsu Zhongpeng New Material Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.40.5 Jiangsu Zhongpeng New Material Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Semiconductor & IC Packaging Materials Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IC Substrates
1.2.3 Bonding Wires
1.2.4 Lead Frames
1.2.5 Gold Wire & Copper Wire
1.2.6 Compound
1.2.7 Ceramic packaging materials
1.2.8 Die Attach Materials
1.2.9 Others
1.3 Market by Application
1.3.1 Global Semiconductor & IC Packaging Materials Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automobile Industry
1.3.3 Electronics Industry
1.3.4 Communication
1.3.5 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Semiconductor & IC Packaging Materials Market Perspective (2019-2030)
2.2 Global Semiconductor & IC Packaging Materials Growth Trends by Region
2.2.1 Global Semiconductor & IC Packaging Materials Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Semiconductor & IC Packaging Materials Historic Market Size by Region (2019-2024)
2.2.3 Semiconductor & IC Packaging Materials Forecasted Market Size by Region (2025-2030)
2.3 Semiconductor & IC Packaging Materials Market Dynamics
2.3.1 Semiconductor & IC Packaging Materials Industry Trends
2.3.2 Semiconductor & IC Packaging Materials Market Drivers
2.3.3 Semiconductor & IC Packaging Materials Market Challenges
2.3.4 Semiconductor & IC Packaging Materials Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Semiconductor & IC Packaging Materials Players by Revenue
3.1.1 Global Top Semiconductor & IC Packaging Materials Players by Revenue (2019-2024)
3.1.2 Global Semiconductor & IC Packaging Materials Revenue Market Share by Players (2019-2024)
3.2 Global Semiconductor & IC Packaging Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Semiconductor & IC Packaging Materials Revenue
3.4 Global Semiconductor & IC Packaging Materials Market Concentration Ratio
3.4.1 Global Semiconductor & IC Packaging Materials Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Semiconductor & IC Packaging Materials Revenue in 2023
3.5 Global Key Players of Semiconductor & IC Packaging Materials Head office and Area Served
3.6 Global Key Players of Semiconductor & IC Packaging Materials, Product and Application
3.7 Global Key Players of Semiconductor & IC Packaging Materials, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Semiconductor & IC Packaging Materials Breakdown Data by Type
4.1 Global Semiconductor & IC Packaging Materials Historic Market Size by Type (2019-2024)
4.2 Global Semiconductor & IC Packaging Materials Forecasted Market Size by Type (2025-2030)
5 Semiconductor & IC Packaging Materials Breakdown Data by Application
5.1 Global Semiconductor & IC Packaging Materials Historic Market Size by Application (2019-2024)
5.2 Global Semiconductor & IC Packaging Materials Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Semiconductor & IC Packaging Materials Market Size (2019-2030)
6.2 North America Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
6.4 North America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Semiconductor & IC Packaging Materials Market Size (2019-2030)
7.2 Europe Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
7.4 Europe Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Semiconductor & IC Packaging Materials Market Size (2019-2030)
8.2 Asia-Pacific Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2019-2024)
8.4 Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Semiconductor & IC Packaging Materials Market Size (2019-2030)
9.2 Latin America Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
9.4 Latin America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Semiconductor & IC Packaging Materials Market Size (2019-2030)
10.2 Middle East & Africa Semiconductor & IC Packaging Materials Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2019-2024)
10.4 Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Unimicron
11.1.1 Unimicron Company Details
11.1.2 Unimicron Business Overview
11.1.3 Unimicron Semiconductor & IC Packaging Materials Introduction
11.1.4 Unimicron Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.1.5 Unimicron Recent Development
11.2 Ibiden
11.2.1 Ibiden Company Details
11.2.2 Ibiden Business Overview
11.2.3 Ibiden Semiconductor & IC Packaging Materials Introduction
11.2.4 Ibiden Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.2.5 Ibiden Recent Development
11.3 Nan Ya PCB
11.3.1 Nan Ya PCB Company Details
11.3.2 Nan Ya PCB Business Overview
11.3.3 Nan Ya PCB Semiconductor & IC Packaging Materials Introduction
11.3.4 Nan Ya PCB Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.3.5 Nan Ya PCB Recent Development
11.4 Shinko Electric Industries
11.4.1 Shinko Electric Industries Company Details
11.4.2 Shinko Electric Industries Business Overview
11.4.3 Shinko Electric Industries Semiconductor & IC Packaging Materials Introduction
11.4.4 Shinko Electric Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.4.5 Shinko Electric Industries Recent Development
11.5 Kinsus Interconnect Technology
11.5.1 Kinsus Interconnect Technology Company Details
11.5.2 Kinsus Interconnect Technology Business Overview
11.5.3 Kinsus Interconnect Technology Semiconductor & IC Packaging Materials Introduction
11.5.4 Kinsus Interconnect Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.5.5 Kinsus Interconnect Technology Recent Development
11.6 AT&S
11.6.1 AT&S Company Details
11.6.2 AT&S Business Overview
11.6.3 AT&S Semiconductor & IC Packaging Materials Introduction
11.6.4 AT&S Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.6.5 AT&S Recent Development
11.7 Samsung Electro-Mechanics
11.7.1 Samsung Electro-Mechanics Company Details
11.7.2 Samsung Electro-Mechanics Business Overview
11.7.3 Samsung Electro-Mechanics Semiconductor & IC Packaging Materials Introduction
11.7.4 Samsung Electro-Mechanics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.7.5 Samsung Electro-Mechanics Recent Development
11.8 Kyocera
11.8.1 Kyocera Company Details
11.8.2 Kyocera Business Overview
11.8.3 Kyocera Semiconductor & IC Packaging Materials Introduction
11.8.4 Kyocera Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.8.5 Kyocera Recent Development
11.9 Toppan
11.9.1 Toppan Company Details
11.9.2 Toppan Business Overview
11.9.3 Toppan Semiconductor & IC Packaging Materials Introduction
11.9.4 Toppan Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.9.5 Toppan Recent Development
11.10 Zhen Ding Technology
11.10.1 Zhen Ding Technology Company Details
11.10.2 Zhen Ding Technology Business Overview
11.10.3 Zhen Ding Technology Semiconductor & IC Packaging Materials Introduction
11.10.4 Zhen Ding Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.10.5 Zhen Ding Technology Recent Development
11.11 Daeduck Electronics
11.11.1 Daeduck Electronics Company Details
11.11.2 Daeduck Electronics Business Overview
11.11.3 Daeduck Electronics Semiconductor & IC Packaging Materials Introduction
11.11.4 Daeduck Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.11.5 Daeduck Electronics Recent Development
11.12 Zhuhai Access Semiconductor
11.12.1 Zhuhai Access Semiconductor Company Details
11.12.2 Zhuhai Access Semiconductor Business Overview
11.12.3 Zhuhai Access Semiconductor Semiconductor & IC Packaging Materials Introduction
11.12.4 Zhuhai Access Semiconductor Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.12.5 Zhuhai Access Semiconductor Recent Development
11.13 LG InnoTek
11.13.1 LG InnoTek Company Details
11.13.2 LG InnoTek Business Overview
11.13.3 LG InnoTek Semiconductor & IC Packaging Materials Introduction
11.13.4 LG InnoTek Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.13.5 LG InnoTek Recent Development
11.14 Shennan Circuit
11.14.1 Shennan Circuit Company Details
11.14.2 Shennan Circuit Business Overview
11.14.3 Shennan Circuit Semiconductor & IC Packaging Materials Introduction
11.14.4 Shennan Circuit Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.14.5 Shennan Circuit Recent Development
11.15 Shenzhen Fastprint Circuit Tech
11.15.1 Shenzhen Fastprint Circuit Tech Company Details
11.15.2 Shenzhen Fastprint Circuit Tech Business Overview
11.15.3 Shenzhen Fastprint Circuit Tech Semiconductor & IC Packaging Materials Introduction
11.15.4 Shenzhen Fastprint Circuit Tech Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.15.5 Shenzhen Fastprint Circuit Tech Recent Development
11.16 Mitsui High-tec
11.16.1 Mitsui High-tec Company Details
11.16.2 Mitsui High-tec Business Overview
11.16.3 Mitsui High-tec Semiconductor & IC Packaging Materials Introduction
11.16.4 Mitsui High-tec Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.16.5 Mitsui High-tec Recent Development
11.17 Henkel
11.17.1 Henkel Company Details
11.17.2 Henkel Business Overview
11.17.3 Henkel Semiconductor & IC Packaging Materials Introduction
11.17.4 Henkel Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.17.5 Henkel Recent Development
11.18 Chang Wah Technology
11.18.1 Chang Wah Technology Company Details
11.18.2 Chang Wah Technology Business Overview
11.18.3 Chang Wah Technology Semiconductor & IC Packaging Materials Introduction
11.18.4 Chang Wah Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.18.5 Chang Wah Technology Recent Development
11.19 Advanced Assembly Materials International
11.19.1 Advanced Assembly Materials International Company Details
11.19.2 Advanced Assembly Materials International Business Overview
11.19.3 Advanced Assembly Materials International Semiconductor & IC Packaging Materials Introduction
11.19.4 Advanced Assembly Materials International Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.19.5 Advanced Assembly Materials International Recent Development
11.20 HAESUNG DS
11.20.1 HAESUNG DS Company Details
11.20.2 HAESUNG DS Business Overview
11.20.3 HAESUNG DS Semiconductor & IC Packaging Materials Introduction
11.20.4 HAESUNG DS Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.20.5 HAESUNG DS Recent Development
11.21 Fusheng Electronics
11.21.1 Fusheng Electronics Company Details
11.21.2 Fusheng Electronics Business Overview
11.21.3 Fusheng Electronics Semiconductor & IC Packaging Materials Introduction
11.21.4 Fusheng Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.21.5 Fusheng Electronics Recent Development
11.22 Enomoto
11.22.1 Enomoto Company Details
11.22.2 Enomoto Business Overview
11.22.3 Enomoto Semiconductor & IC Packaging Materials Introduction
11.22.4 Enomoto Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.22.5 Enomoto Recent Development
11.23 Kangqiang
11.23.1 Kangqiang Company Details
11.23.2 Kangqiang Business Overview
11.23.3 Kangqiang Semiconductor & IC Packaging Materials Introduction
11.23.4 Kangqiang Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.23.5 Kangqiang Recent Development
11.24 POSSEHL
11.24.1 POSSEHL Company Details
11.24.2 POSSEHL Business Overview
11.24.3 POSSEHL Semiconductor & IC Packaging Materials Introduction
11.24.4 POSSEHL Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.24.5 POSSEHL Recent Development
11.25 JIH LIN TECHNOLOGY
11.25.1 JIH LIN TECHNOLOGY Company Details
11.25.2 JIH LIN TECHNOLOGY Business Overview
11.25.3 JIH LIN TECHNOLOGY Semiconductor & IC Packaging Materials Introduction
11.25.4 JIH LIN TECHNOLOGY Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.25.5 JIH LIN TECHNOLOGY Recent Development
11.26 Hualong
11.26.1 Hualong Company Details
11.26.2 Hualong Business Overview
11.26.3 Hualong Semiconductor & IC Packaging Materials Introduction
11.26.4 Hualong Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.26.5 Hualong Recent Development
11.27 Dynacraft Industries
11.27.1 Dynacraft Industries Company Details
11.27.2 Dynacraft Industries Business Overview
11.27.3 Dynacraft Industries Semiconductor & IC Packaging Materials Introduction
11.27.4 Dynacraft Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.27.5 Dynacraft Industries Recent Development
11.28 QPL Limited
11.28.1 QPL Limited Company Details
11.28.2 QPL Limited Business Overview
11.28.3 QPL Limited Semiconductor & IC Packaging Materials Introduction
11.28.4 QPL Limited Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.28.5 QPL Limited Recent Development
11.29 WUXI HUAJING LEADFRAME
11.29.1 WUXI HUAJING LEADFRAME Company Details
11.29.2 WUXI HUAJING LEADFRAME Business Overview
11.29.3 WUXI HUAJING LEADFRAME Semiconductor & IC Packaging Materials Introduction
11.29.4 WUXI HUAJING LEADFRAME Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.29.5 WUXI HUAJING LEADFRAME Recent Development
11.30 HUAYANG ELECTRONIC
11.30.1 HUAYANG ELECTRONIC Company Details
11.30.2 HUAYANG ELECTRONIC Business Overview
11.30.3 HUAYANG ELECTRONIC Semiconductor & IC Packaging Materials Introduction
11.30.4 HUAYANG ELECTRONIC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.30.5 HUAYANG ELECTRONIC Recent Development
11.31 DNP
11.31.1 DNP Company Details
11.31.2 DNP Business Overview
11.31.3 DNP Semiconductor & IC Packaging Materials Introduction
11.31.4 DNP Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.31.5 DNP Recent Development
11.32 Xiamen Jsun Precision Technology
11.32.1 Xiamen Jsun Precision Technology Company Details
11.32.2 Xiamen Jsun Precision Technology Business Overview
11.32.3 Xiamen Jsun Precision Technology Semiconductor & IC Packaging Materials Introduction
11.32.4 Xiamen Jsun Precision Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.32.5 Xiamen Jsun Precision Technology Recent Development
11.33 Sumitomo Bakelite
11.33.1 Sumitomo Bakelite Company Details
11.33.2 Sumitomo Bakelite Business Overview
11.33.3 Sumitomo Bakelite Semiconductor & IC Packaging Materials Introduction
11.33.4 Sumitomo Bakelite Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.33.5 Sumitomo Bakelite Recent Development
11.34 Showa Denko
11.34.1 Showa Denko Company Details
11.34.2 Showa Denko Business Overview
11.34.3 Showa Denko Semiconductor & IC Packaging Materials Introduction
11.34.4 Showa Denko Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.34.5 Showa Denko Recent Development
11.35 Chang Chun Group
11.35.1 Chang Chun Group Company Details
11.35.2 Chang Chun Group Business Overview
11.35.3 Chang Chun Group Semiconductor & IC Packaging Materials Introduction
11.35.4 Chang Chun Group Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.35.5 Chang Chun Group Recent Development
11.36 Hysol Huawei Electronics
11.36.1 Hysol Huawei Electronics Company Details
11.36.2 Hysol Huawei Electronics Business Overview
11.36.3 Hysol Huawei Electronics Semiconductor & IC Packaging Materials Introduction
11.36.4 Hysol Huawei Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.36.5 Hysol Huawei Electronics Recent Development
11.37 Panasonic
11.37.1 Panasonic Company Details
11.37.2 Panasonic Business Overview
11.37.3 Panasonic Semiconductor & IC Packaging Materials Introduction
11.37.4 Panasonic Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.37.5 Panasonic Recent Development
11.38 KCC
11.38.1 KCC Company Details
11.38.2 KCC Business Overview
11.38.3 KCC Semiconductor & IC Packaging Materials Introduction
11.38.4 KCC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.38.5 KCC Recent Development
11.39 Eternal Materials
11.39.1 Eternal Materials Company Details
11.39.2 Eternal Materials Business Overview
11.39.3 Eternal Materials Semiconductor & IC Packaging Materials Introduction
11.39.4 Eternal Materials Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.39.5 Eternal Materials Recent Development
11.40 Jiangsu Zhongpeng New Material
11.40.1 Jiangsu Zhongpeng New Material Company Details
11.40.2 Jiangsu Zhongpeng New Material Business Overview
11.40.3 Jiangsu Zhongpeng New Material Semiconductor & IC Packaging Materials Introduction
11.40.4 Jiangsu Zhongpeng New Material Revenue in Semiconductor & IC Packaging Materials Business (2019-2024)
11.40.5 Jiangsu Zhongpeng New Material Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
List of Tables
Table 1. Global Semiconductor & IC Packaging Materials Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of IC Substrates
Table 3. Key Players of Bonding Wires
Table 4. Key Players of Lead Frames
Table 5. Key Players of Gold Wire & Copper Wire
Table 6. Key Players of Compound
Table 7. Key Players of Ceramic packaging materials
Table 8. Key Players of Die Attach Materials
Table 9. Global Semiconductor & IC Packaging Materials Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 10. Global Semiconductor & IC Packaging Materials Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 11. Global Semiconductor & IC Packaging Materials Market Size by Region (2019-2024) & (US$ Million)
Table 12. Global Semiconductor & IC Packaging Materials Market Share by Region (2019-2024)
Table 13. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 14. Global Semiconductor & IC Packaging Materials Market Share by Region (2025-2030)
Table 15. Semiconductor & IC Packaging Materials Market Trends
Table 16. Semiconductor & IC Packaging Materials Market Drivers
Table 17. Semiconductor & IC Packaging Materials Market Challenges
Table 18. Semiconductor & IC Packaging Materials Market Restraints
Table 19. Global Semiconductor & IC Packaging Materials Revenue by Players (2019-2024) & (US$ Million)
Table 20. Global Semiconductor & IC Packaging Materials Market Share by Players (2019-2024)
Table 21. Global Top Semiconductor & IC Packaging Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor & IC Packaging Materials as of 2023)
Table 22. Ranking of Global Top Semiconductor & IC Packaging Materials Companies by Revenue (US$ Million) in 2023
Table 23. Global 5 Largest Players Market Share by Semiconductor & IC Packaging Materials Revenue (CR5 and HHI) & (2019-2024)
Table 24. Global Key Players of Semiconductor & IC Packaging Materials, Headquarters and Area Served
Table 25. Global Key Players of Semiconductor & IC Packaging Materials, Product and Application
Table 26. Global Key Players of Semiconductor & IC Packaging Materials, Date of Enter into This Industry
Table 27. Mergers & Acquisitions, Expansion Plans
Table 28. Global Semiconductor & IC Packaging Materials Market Size by Type (2019-2024) & (US$ Million)
Table 29. Global Semiconductor & IC Packaging Materials Revenue Market Share by Type (2019-2024)
Table 30. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 31. Global Semiconductor & IC Packaging Materials Revenue Market Share by Type (2025-2030)
Table 32. Global Semiconductor & IC Packaging Materials Market Size by Application (2019-2024) & (US$ Million)
Table 33. Global Semiconductor & IC Packaging Materials Revenue Market Share by Application (2019-2024)
Table 34. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 35. Global Semiconductor & IC Packaging Materials Revenue Market Share by Application (2025-2030)
Table 36. North America Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 37. North America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 38. North America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 39. Europe Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 40. Europe Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 41. Europe Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 42. Asia-Pacific Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 43. Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2019-2024) & (US$ Million)
Table 44. Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2025-2030) & (US$ Million)
Table 45. Latin America Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 46. Latin America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 47. Latin America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 48. Middle East & Africa Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 49. Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 50. Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 51. Unimicron Company Details
Table 52. Unimicron Business Overview
Table 53. Unimicron Semiconductor & IC Packaging Materials Product
Table 54. Unimicron Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 55. Unimicron Recent Development
Table 56. Ibiden Company Details
Table 57. Ibiden Business Overview
Table 58. Ibiden Semiconductor & IC Packaging Materials Product
Table 59. Ibiden Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 60. Ibiden Recent Development
Table 61. Nan Ya PCB Company Details
Table 62. Nan Ya PCB Business Overview
Table 63. Nan Ya PCB Semiconductor & IC Packaging Materials Product
Table 64. Nan Ya PCB Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 65. Nan Ya PCB Recent Development
Table 66. Shinko Electric Industries Company Details
Table 67. Shinko Electric Industries Business Overview
Table 68. Shinko Electric Industries Semiconductor & IC Packaging Materials Product
Table 69. Shinko Electric Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 70. Shinko Electric Industries Recent Development
Table 71. Kinsus Interconnect Technology Company Details
Table 72. Kinsus Interconnect Technology Business Overview
Table 73. Kinsus Interconnect Technology Semiconductor & IC Packaging Materials Product
Table 74. Kinsus Interconnect Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 75. Kinsus Interconnect Technology Recent Development
Table 76. AT&S Company Details
Table 77. AT&S Business Overview
Table 78. AT&S Semiconductor & IC Packaging Materials Product
Table 79. AT&S Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 80. AT&S Recent Development
Table 81. Samsung Electro-Mechanics Company Details
Table 82. Samsung Electro-Mechanics Business Overview
Table 83. Samsung Electro-Mechanics Semiconductor & IC Packaging Materials Product
Table 84. Samsung Electro-Mechanics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 85. Samsung Electro-Mechanics Recent Development
Table 86. Kyocera Company Details
Table 87. Kyocera Business Overview
Table 88. Kyocera Semiconductor & IC Packaging Materials Product
Table 89. Kyocera Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 90. Kyocera Recent Development
Table 91. Toppan Company Details
Table 92. Toppan Business Overview
Table 93. Toppan Semiconductor & IC Packaging Materials Product
Table 94. Toppan Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 95. Toppan Recent Development
Table 96. Zhen Ding Technology Company Details
Table 97. Zhen Ding Technology Business Overview
Table 98. Zhen Ding Technology Semiconductor & IC Packaging Materials Product
Table 99. Zhen Ding Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 100. Zhen Ding Technology Recent Development
Table 101. Daeduck Electronics Company Details
Table 102. Daeduck Electronics Business Overview
Table 103. Daeduck Electronics Semiconductor & IC Packaging Materials Product
Table 104. Daeduck Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 105. Daeduck Electronics Recent Development
Table 106. Zhuhai Access Semiconductor Company Details
Table 107. Zhuhai Access Semiconductor Business Overview
Table 108. Zhuhai Access Semiconductor Semiconductor & IC Packaging Materials Product
Table 109. Zhuhai Access Semiconductor Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 110. Zhuhai Access Semiconductor Recent Development
Table 111. LG InnoTek Company Details
Table 112. LG InnoTek Business Overview
Table 113. LG InnoTek Semiconductor & IC Packaging Materials Product
Table 114. LG InnoTek Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 115. LG InnoTek Recent Development
Table 116. Shennan Circuit Company Details
Table 117. Shennan Circuit Business Overview
Table 118. Shennan Circuit Semiconductor & IC Packaging Materials Product
Table 119. Shennan Circuit Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 120. Shennan Circuit Recent Development
Table 121. Shenzhen Fastprint Circuit Tech Company Details
Table 122. Shenzhen Fastprint Circuit Tech Business Overview
Table 123. Shenzhen Fastprint Circuit Tech Semiconductor & IC Packaging Materials Product
Table 124. Shenzhen Fastprint Circuit Tech Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 125. Shenzhen Fastprint Circuit Tech Recent Development
Table 126. Mitsui High-tec Company Details
Table 127. Mitsui High-tec Business Overview
Table 128. Mitsui High-tec Semiconductor & IC Packaging Materials Product
Table 129. Mitsui High-tec Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 130. Mitsui High-tec Recent Development
Table 131. Henkel Company Details
Table 132. Henkel Business Overview
Table 133. Henkel Semiconductor & IC Packaging Materials Product
Table 134. Henkel Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 135. Henkel Recent Development
Table 136. Chang Wah Technology Company Details
Table 137. Chang Wah Technology Business Overview
Table 138. Chang Wah Technology Semiconductor & IC Packaging Materials Product
Table 139. Chang Wah Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 140. Chang Wah Technology Recent Development
Table 141. Advanced Assembly Materials International Company Details
Table 142. Advanced Assembly Materials International Business Overview
Table 143. Advanced Assembly Materials International Semiconductor & IC Packaging Materials Product
Table 144. Advanced Assembly Materials International Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 145. Advanced Assembly Materials International Recent Development
Table 146. HAESUNG DS Company Details
Table 147. HAESUNG DS Business Overview
Table 148. HAESUNG DS Semiconductor & IC Packaging Materials Product
Table 149. HAESUNG DS Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 150. HAESUNG DS Recent Development
Table 151. Fusheng Electronics Company Details
Table 152. Fusheng Electronics Business Overview
Table 153. Fusheng Electronics Semiconductor & IC Packaging Materials Product
Table 154. Fusheng Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 155. Fusheng Electronics Recent Development
Table 156. Enomoto Company Details
Table 157. Enomoto Business Overview
Table 158. Enomoto Semiconductor & IC Packaging Materials Product
Table 159. Enomoto Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 160. Enomoto Recent Development
Table 161. Kangqiang Company Details
Table 162. Kangqiang Business Overview
Table 163. Kangqiang Semiconductor & IC Packaging Materials Product
Table 164. Kangqiang Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 165. Kangqiang Recent Development
Table 166. POSSEHL Company Details
Table 167. POSSEHL Business Overview
Table 168. POSSEHL Semiconductor & IC Packaging Materials Product
Table 169. POSSEHL Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 170. POSSEHL Recent Development
Table 171. JIH LIN TECHNOLOGY Company Details
Table 172. JIH LIN TECHNOLOGY Business Overview
Table 173. JIH LIN TECHNOLOGY Semiconductor & IC Packaging Materials Product
Table 174. JIH LIN TECHNOLOGY Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 175. JIH LIN TECHNOLOGY Recent Development
Table 176. Hualong Company Details
Table 177. Hualong Business Overview
Table 178. Hualong Semiconductor & IC Packaging Materials Product
Table 179. Hualong Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 180. Hualong Recent Development
Table 181. Dynacraft Industries Company Details
Table 182. Dynacraft Industries Business Overview
Table 183. Dynacraft Industries Semiconductor & IC Packaging Materials Product
Table 184. Dynacraft Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 185. Dynacraft Industries Recent Development
Table 186. QPL Limited Company Details
Table 187. QPL Limited Business Overview
Table 188. QPL Limited Semiconductor & IC Packaging Materials Product
Table 189. QPL Limited Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 190. QPL Limited Recent Development
Table 191. WUXI HUAJING LEADFRAME Company Details
Table 192. WUXI HUAJING LEADFRAME Business Overview
Table 193. WUXI HUAJING LEADFRAME Semiconductor & IC Packaging Materials Product
Table 194. WUXI HUAJING LEADFRAME Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 195. WUXI HUAJING LEADFRAME Recent Development
Table 196. HUAYANG ELECTRONIC Company Details
Table 197. HUAYANG ELECTRONIC Business Overview
Table 198. HUAYANG ELECTRONIC Semiconductor & IC Packaging Materials Product
Table 199. HUAYANG ELECTRONIC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 200. HUAYANG ELECTRONIC Recent Development
Table 201. DNP Company Details
Table 202. DNP Business Overview
Table 203. DNP Semiconductor & IC Packaging Materials Product
Table 204. DNP Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 205. DNP Recent Development
Table 206. Xiamen Jsun Precision Technology Company Details
Table 207. Xiamen Jsun Precision Technology Business Overview
Table 208. Xiamen Jsun Precision Technology Semiconductor & IC Packaging Materials Product
Table 209. Xiamen Jsun Precision Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 210. Xiamen Jsun Precision Technology Recent Development
Table 211. Sumitomo Bakelite Company Details
Table 212. Sumitomo Bakelite Business Overview
Table 213. Sumitomo Bakelite Semiconductor & IC Packaging Materials Product
Table 214. Sumitomo Bakelite Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 215. Sumitomo Bakelite Recent Development
Table 216. Showa Denko Company Details
Table 217. Showa Denko Business Overview
Table 218. Showa Denko Semiconductor & IC Packaging Materials Product
Table 219. Showa Denko Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 220. Showa Denko Recent Development
Table 221. Chang Chun Group Company Details
Table 222. Chang Chun Group Business Overview
Table 223. Chang Chun Group Semiconductor & IC Packaging Materials Product
Table 224. Chang Chun Group Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 225. Chang Chun Group Recent Development
Table 226. Hysol Huawei Electronics Company Details
Table 227. Hysol Huawei Electronics Business Overview
Table 228. Hysol Huawei Electronics Semiconductor & IC Packaging Materials Product
Table 229. Hysol Huawei Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 230. Hysol Huawei Electronics Recent Development
Table 231. Panasonic Company Details
Table 232. Panasonic Business Overview
Table 233. Panasonic Semiconductor & IC Packaging Materials Product
Table 234. Panasonic Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 235. Panasonic Recent Development
Table 236. KCC Company Details
Table 237. KCC Business Overview
Table 238. KCC Semiconductor & IC Packaging Materials Product
Table 239. KCC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 240. KCC Recent Development
Table 241. Eternal Materials Company Details
Table 242. Eternal Materials Business Overview
Table 243. Eternal Materials Semiconductor & IC Packaging Materials Product
Table 244. Eternal Materials Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 245. Eternal Materials Recent Development
Table 246. Jiangsu Zhongpeng New Material Company Details
Table 247. Jiangsu Zhongpeng New Material Business Overview
Table 248. Jiangsu Zhongpeng New Material Semiconductor & IC Packaging Materials Product
Table 249. Jiangsu Zhongpeng New Material Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 250. Jiangsu Zhongpeng New Material Recent Development
Table 251. Research Programs/Design for This Report
Table 252. Key Data Information from Secondary Sources
Table 253. Key Data Information from Primary Sources
Table 254. Authors List of This Report
List of Figures
Figure 1. Semiconductor & IC Packaging Materials Picture
Figure 2. Global Semiconductor & IC Packaging Materials Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 3. Global Semiconductor & IC Packaging Materials Market Share by Type: 2023 VS 2030
Figure 4. IC Substrates Features
Figure 5. Bonding Wires Features
Figure 6. Lead Frames Features
Figure 7. Gold Wire & Copper Wire Features
Figure 8. Compound Features
Figure 9. Ceramic packaging materials Features
Figure 10. Die Attach Materials Features
Figure 11. Others Features
Figure 12. Global Semiconductor & IC Packaging Materials Market Size by Application (2024-2030) & (US$ Million)
Figure 13. Global Semiconductor & IC Packaging Materials Market Share by Application: 2023 VS 2030
Figure 14. Automobile Industry Case Studies
Figure 15. Electronics Industry Case Studies
Figure 16. Communication Case Studies
Figure 17. Other Case Studies
Figure 18. Semiconductor & IC Packaging Materials Report Years Considered
Figure 19. Global Semiconductor & IC Packaging Materials Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 20. Global Semiconductor & IC Packaging Materials Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 21. Global Semiconductor & IC Packaging Materials Market Share by Region: 2023 VS 2030
Figure 22. Global Semiconductor & IC Packaging Materials Market Share by Players in 2023
Figure 23. Global Top Semiconductor & IC Packaging Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor & IC Packaging Materials as of 2023)
Figure 24. The Top 10 and 5 Players Market Share by Semiconductor & IC Packaging Materials Revenue in 2023
Figure 25. North America Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. North America Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 27. United States Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Canada Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Europe Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Europe Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 31. Germany Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 32. France Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. U.K. Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. Italy Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. Russia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. Nordic Countries Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Asia-Pacific Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Asia-Pacific Semiconductor & IC Packaging Materials Market Share by Region (2019-2030)
Figure 39. China Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 40. Japan Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. South Korea Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Southeast Asia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. India Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 44. Australia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. Latin America Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. Latin America Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 47. Mexico Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 48. Brazil Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 49. Middle East & Africa Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 50. Middle East & Africa Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 51. Turkey Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 52. Saudi Arabia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 53. UAE Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 54. Unimicron Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 55. Ibiden Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 56. Nan Ya PCB Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 57. Shinko Electric Industries Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 58. Kinsus Interconnect Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 59. AT&S Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 60. Samsung Electro-Mechanics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 61. Kyocera Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 62. Toppan Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 63. Zhen Ding Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 64. Daeduck Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 65. Zhuhai Access Semiconductor Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 66. LG InnoTek Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 67. Shennan Circuit Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 68. Shenzhen Fastprint Circuit Tech Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 69. Mitsui High-tec Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 70. Henkel Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 71. Chang Wah Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 72. Advanced Assembly Materials International Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 73. HAESUNG DS Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 74. Fusheng Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 75. Enomoto Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 76. Kangqiang Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 77. POSSEHL Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 78. JIH LIN TECHNOLOGY Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 79. Hualong Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 80. Dynacraft Industries Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 81. QPL Limited Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 82. WUXI HUAJING LEADFRAME Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 83. HUAYANG ELECTRONIC Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 84. DNP Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 85. Xiamen Jsun Precision Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 86. Sumitomo Bakelite Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 87. Showa Denko Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 88. Chang Chun Group Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 89. Hysol Huawei Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 90. Panasonic Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 91. KCC Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 92. Eternal Materials Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 93. Jiangsu Zhongpeng New Material Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 94. Bottom-up and Top-down Approaches for This Report
Figure 95. Data Triangulation
Figure 96. Key Executives Interviewed
Table 1. Global Semiconductor & IC Packaging Materials Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of IC Substrates
Table 3. Key Players of Bonding Wires
Table 4. Key Players of Lead Frames
Table 5. Key Players of Gold Wire & Copper Wire
Table 6. Key Players of Compound
Table 7. Key Players of Ceramic packaging materials
Table 8. Key Players of Die Attach Materials
Table 9. Global Semiconductor & IC Packaging Materials Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 10. Global Semiconductor & IC Packaging Materials Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 11. Global Semiconductor & IC Packaging Materials Market Size by Region (2019-2024) & (US$ Million)
Table 12. Global Semiconductor & IC Packaging Materials Market Share by Region (2019-2024)
Table 13. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 14. Global Semiconductor & IC Packaging Materials Market Share by Region (2025-2030)
Table 15. Semiconductor & IC Packaging Materials Market Trends
Table 16. Semiconductor & IC Packaging Materials Market Drivers
Table 17. Semiconductor & IC Packaging Materials Market Challenges
Table 18. Semiconductor & IC Packaging Materials Market Restraints
Table 19. Global Semiconductor & IC Packaging Materials Revenue by Players (2019-2024) & (US$ Million)
Table 20. Global Semiconductor & IC Packaging Materials Market Share by Players (2019-2024)
Table 21. Global Top Semiconductor & IC Packaging Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor & IC Packaging Materials as of 2023)
Table 22. Ranking of Global Top Semiconductor & IC Packaging Materials Companies by Revenue (US$ Million) in 2023
Table 23. Global 5 Largest Players Market Share by Semiconductor & IC Packaging Materials Revenue (CR5 and HHI) & (2019-2024)
Table 24. Global Key Players of Semiconductor & IC Packaging Materials, Headquarters and Area Served
Table 25. Global Key Players of Semiconductor & IC Packaging Materials, Product and Application
Table 26. Global Key Players of Semiconductor & IC Packaging Materials, Date of Enter into This Industry
Table 27. Mergers & Acquisitions, Expansion Plans
Table 28. Global Semiconductor & IC Packaging Materials Market Size by Type (2019-2024) & (US$ Million)
Table 29. Global Semiconductor & IC Packaging Materials Revenue Market Share by Type (2019-2024)
Table 30. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 31. Global Semiconductor & IC Packaging Materials Revenue Market Share by Type (2025-2030)
Table 32. Global Semiconductor & IC Packaging Materials Market Size by Application (2019-2024) & (US$ Million)
Table 33. Global Semiconductor & IC Packaging Materials Revenue Market Share by Application (2019-2024)
Table 34. Global Semiconductor & IC Packaging Materials Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 35. Global Semiconductor & IC Packaging Materials Revenue Market Share by Application (2025-2030)
Table 36. North America Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 37. North America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 38. North America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 39. Europe Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 40. Europe Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 41. Europe Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 42. Asia-Pacific Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 43. Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2019-2024) & (US$ Million)
Table 44. Asia-Pacific Semiconductor & IC Packaging Materials Market Size by Region (2025-2030) & (US$ Million)
Table 45. Latin America Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 46. Latin America Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 47. Latin America Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 48. Middle East & Africa Semiconductor & IC Packaging Materials Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 49. Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2019-2024) & (US$ Million)
Table 50. Middle East & Africa Semiconductor & IC Packaging Materials Market Size by Country (2025-2030) & (US$ Million)
Table 51. Unimicron Company Details
Table 52. Unimicron Business Overview
Table 53. Unimicron Semiconductor & IC Packaging Materials Product
Table 54. Unimicron Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 55. Unimicron Recent Development
Table 56. Ibiden Company Details
Table 57. Ibiden Business Overview
Table 58. Ibiden Semiconductor & IC Packaging Materials Product
Table 59. Ibiden Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 60. Ibiden Recent Development
Table 61. Nan Ya PCB Company Details
Table 62. Nan Ya PCB Business Overview
Table 63. Nan Ya PCB Semiconductor & IC Packaging Materials Product
Table 64. Nan Ya PCB Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 65. Nan Ya PCB Recent Development
Table 66. Shinko Electric Industries Company Details
Table 67. Shinko Electric Industries Business Overview
Table 68. Shinko Electric Industries Semiconductor & IC Packaging Materials Product
Table 69. Shinko Electric Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 70. Shinko Electric Industries Recent Development
Table 71. Kinsus Interconnect Technology Company Details
Table 72. Kinsus Interconnect Technology Business Overview
Table 73. Kinsus Interconnect Technology Semiconductor & IC Packaging Materials Product
Table 74. Kinsus Interconnect Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 75. Kinsus Interconnect Technology Recent Development
Table 76. AT&S Company Details
Table 77. AT&S Business Overview
Table 78. AT&S Semiconductor & IC Packaging Materials Product
Table 79. AT&S Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 80. AT&S Recent Development
Table 81. Samsung Electro-Mechanics Company Details
Table 82. Samsung Electro-Mechanics Business Overview
Table 83. Samsung Electro-Mechanics Semiconductor & IC Packaging Materials Product
Table 84. Samsung Electro-Mechanics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 85. Samsung Electro-Mechanics Recent Development
Table 86. Kyocera Company Details
Table 87. Kyocera Business Overview
Table 88. Kyocera Semiconductor & IC Packaging Materials Product
Table 89. Kyocera Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 90. Kyocera Recent Development
Table 91. Toppan Company Details
Table 92. Toppan Business Overview
Table 93. Toppan Semiconductor & IC Packaging Materials Product
Table 94. Toppan Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 95. Toppan Recent Development
Table 96. Zhen Ding Technology Company Details
Table 97. Zhen Ding Technology Business Overview
Table 98. Zhen Ding Technology Semiconductor & IC Packaging Materials Product
Table 99. Zhen Ding Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 100. Zhen Ding Technology Recent Development
Table 101. Daeduck Electronics Company Details
Table 102. Daeduck Electronics Business Overview
Table 103. Daeduck Electronics Semiconductor & IC Packaging Materials Product
Table 104. Daeduck Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 105. Daeduck Electronics Recent Development
Table 106. Zhuhai Access Semiconductor Company Details
Table 107. Zhuhai Access Semiconductor Business Overview
Table 108. Zhuhai Access Semiconductor Semiconductor & IC Packaging Materials Product
Table 109. Zhuhai Access Semiconductor Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 110. Zhuhai Access Semiconductor Recent Development
Table 111. LG InnoTek Company Details
Table 112. LG InnoTek Business Overview
Table 113. LG InnoTek Semiconductor & IC Packaging Materials Product
Table 114. LG InnoTek Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 115. LG InnoTek Recent Development
Table 116. Shennan Circuit Company Details
Table 117. Shennan Circuit Business Overview
Table 118. Shennan Circuit Semiconductor & IC Packaging Materials Product
Table 119. Shennan Circuit Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 120. Shennan Circuit Recent Development
Table 121. Shenzhen Fastprint Circuit Tech Company Details
Table 122. Shenzhen Fastprint Circuit Tech Business Overview
Table 123. Shenzhen Fastprint Circuit Tech Semiconductor & IC Packaging Materials Product
Table 124. Shenzhen Fastprint Circuit Tech Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 125. Shenzhen Fastprint Circuit Tech Recent Development
Table 126. Mitsui High-tec Company Details
Table 127. Mitsui High-tec Business Overview
Table 128. Mitsui High-tec Semiconductor & IC Packaging Materials Product
Table 129. Mitsui High-tec Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 130. Mitsui High-tec Recent Development
Table 131. Henkel Company Details
Table 132. Henkel Business Overview
Table 133. Henkel Semiconductor & IC Packaging Materials Product
Table 134. Henkel Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 135. Henkel Recent Development
Table 136. Chang Wah Technology Company Details
Table 137. Chang Wah Technology Business Overview
Table 138. Chang Wah Technology Semiconductor & IC Packaging Materials Product
Table 139. Chang Wah Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 140. Chang Wah Technology Recent Development
Table 141. Advanced Assembly Materials International Company Details
Table 142. Advanced Assembly Materials International Business Overview
Table 143. Advanced Assembly Materials International Semiconductor & IC Packaging Materials Product
Table 144. Advanced Assembly Materials International Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 145. Advanced Assembly Materials International Recent Development
Table 146. HAESUNG DS Company Details
Table 147. HAESUNG DS Business Overview
Table 148. HAESUNG DS Semiconductor & IC Packaging Materials Product
Table 149. HAESUNG DS Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 150. HAESUNG DS Recent Development
Table 151. Fusheng Electronics Company Details
Table 152. Fusheng Electronics Business Overview
Table 153. Fusheng Electronics Semiconductor & IC Packaging Materials Product
Table 154. Fusheng Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 155. Fusheng Electronics Recent Development
Table 156. Enomoto Company Details
Table 157. Enomoto Business Overview
Table 158. Enomoto Semiconductor & IC Packaging Materials Product
Table 159. Enomoto Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 160. Enomoto Recent Development
Table 161. Kangqiang Company Details
Table 162. Kangqiang Business Overview
Table 163. Kangqiang Semiconductor & IC Packaging Materials Product
Table 164. Kangqiang Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 165. Kangqiang Recent Development
Table 166. POSSEHL Company Details
Table 167. POSSEHL Business Overview
Table 168. POSSEHL Semiconductor & IC Packaging Materials Product
Table 169. POSSEHL Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 170. POSSEHL Recent Development
Table 171. JIH LIN TECHNOLOGY Company Details
Table 172. JIH LIN TECHNOLOGY Business Overview
Table 173. JIH LIN TECHNOLOGY Semiconductor & IC Packaging Materials Product
Table 174. JIH LIN TECHNOLOGY Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 175. JIH LIN TECHNOLOGY Recent Development
Table 176. Hualong Company Details
Table 177. Hualong Business Overview
Table 178. Hualong Semiconductor & IC Packaging Materials Product
Table 179. Hualong Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 180. Hualong Recent Development
Table 181. Dynacraft Industries Company Details
Table 182. Dynacraft Industries Business Overview
Table 183. Dynacraft Industries Semiconductor & IC Packaging Materials Product
Table 184. Dynacraft Industries Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 185. Dynacraft Industries Recent Development
Table 186. QPL Limited Company Details
Table 187. QPL Limited Business Overview
Table 188. QPL Limited Semiconductor & IC Packaging Materials Product
Table 189. QPL Limited Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 190. QPL Limited Recent Development
Table 191. WUXI HUAJING LEADFRAME Company Details
Table 192. WUXI HUAJING LEADFRAME Business Overview
Table 193. WUXI HUAJING LEADFRAME Semiconductor & IC Packaging Materials Product
Table 194. WUXI HUAJING LEADFRAME Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 195. WUXI HUAJING LEADFRAME Recent Development
Table 196. HUAYANG ELECTRONIC Company Details
Table 197. HUAYANG ELECTRONIC Business Overview
Table 198. HUAYANG ELECTRONIC Semiconductor & IC Packaging Materials Product
Table 199. HUAYANG ELECTRONIC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 200. HUAYANG ELECTRONIC Recent Development
Table 201. DNP Company Details
Table 202. DNP Business Overview
Table 203. DNP Semiconductor & IC Packaging Materials Product
Table 204. DNP Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 205. DNP Recent Development
Table 206. Xiamen Jsun Precision Technology Company Details
Table 207. Xiamen Jsun Precision Technology Business Overview
Table 208. Xiamen Jsun Precision Technology Semiconductor & IC Packaging Materials Product
Table 209. Xiamen Jsun Precision Technology Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 210. Xiamen Jsun Precision Technology Recent Development
Table 211. Sumitomo Bakelite Company Details
Table 212. Sumitomo Bakelite Business Overview
Table 213. Sumitomo Bakelite Semiconductor & IC Packaging Materials Product
Table 214. Sumitomo Bakelite Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 215. Sumitomo Bakelite Recent Development
Table 216. Showa Denko Company Details
Table 217. Showa Denko Business Overview
Table 218. Showa Denko Semiconductor & IC Packaging Materials Product
Table 219. Showa Denko Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 220. Showa Denko Recent Development
Table 221. Chang Chun Group Company Details
Table 222. Chang Chun Group Business Overview
Table 223. Chang Chun Group Semiconductor & IC Packaging Materials Product
Table 224. Chang Chun Group Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 225. Chang Chun Group Recent Development
Table 226. Hysol Huawei Electronics Company Details
Table 227. Hysol Huawei Electronics Business Overview
Table 228. Hysol Huawei Electronics Semiconductor & IC Packaging Materials Product
Table 229. Hysol Huawei Electronics Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 230. Hysol Huawei Electronics Recent Development
Table 231. Panasonic Company Details
Table 232. Panasonic Business Overview
Table 233. Panasonic Semiconductor & IC Packaging Materials Product
Table 234. Panasonic Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 235. Panasonic Recent Development
Table 236. KCC Company Details
Table 237. KCC Business Overview
Table 238. KCC Semiconductor & IC Packaging Materials Product
Table 239. KCC Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 240. KCC Recent Development
Table 241. Eternal Materials Company Details
Table 242. Eternal Materials Business Overview
Table 243. Eternal Materials Semiconductor & IC Packaging Materials Product
Table 244. Eternal Materials Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 245. Eternal Materials Recent Development
Table 246. Jiangsu Zhongpeng New Material Company Details
Table 247. Jiangsu Zhongpeng New Material Business Overview
Table 248. Jiangsu Zhongpeng New Material Semiconductor & IC Packaging Materials Product
Table 249. Jiangsu Zhongpeng New Material Revenue in Semiconductor & IC Packaging Materials Business (2019-2024) & (US$ Million)
Table 250. Jiangsu Zhongpeng New Material Recent Development
Table 251. Research Programs/Design for This Report
Table 252. Key Data Information from Secondary Sources
Table 253. Key Data Information from Primary Sources
Table 254. Authors List of This Report
List of Figures
Figure 1. Semiconductor & IC Packaging Materials Picture
Figure 2. Global Semiconductor & IC Packaging Materials Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 3. Global Semiconductor & IC Packaging Materials Market Share by Type: 2023 VS 2030
Figure 4. IC Substrates Features
Figure 5. Bonding Wires Features
Figure 6. Lead Frames Features
Figure 7. Gold Wire & Copper Wire Features
Figure 8. Compound Features
Figure 9. Ceramic packaging materials Features
Figure 10. Die Attach Materials Features
Figure 11. Others Features
Figure 12. Global Semiconductor & IC Packaging Materials Market Size by Application (2024-2030) & (US$ Million)
Figure 13. Global Semiconductor & IC Packaging Materials Market Share by Application: 2023 VS 2030
Figure 14. Automobile Industry Case Studies
Figure 15. Electronics Industry Case Studies
Figure 16. Communication Case Studies
Figure 17. Other Case Studies
Figure 18. Semiconductor & IC Packaging Materials Report Years Considered
Figure 19. Global Semiconductor & IC Packaging Materials Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 20. Global Semiconductor & IC Packaging Materials Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 21. Global Semiconductor & IC Packaging Materials Market Share by Region: 2023 VS 2030
Figure 22. Global Semiconductor & IC Packaging Materials Market Share by Players in 2023
Figure 23. Global Top Semiconductor & IC Packaging Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor & IC Packaging Materials as of 2023)
Figure 24. The Top 10 and 5 Players Market Share by Semiconductor & IC Packaging Materials Revenue in 2023
Figure 25. North America Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. North America Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 27. United States Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Canada Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Europe Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Europe Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 31. Germany Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 32. France Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. U.K. Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. Italy Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. Russia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. Nordic Countries Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Asia-Pacific Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Asia-Pacific Semiconductor & IC Packaging Materials Market Share by Region (2019-2030)
Figure 39. China Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 40. Japan Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. South Korea Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Southeast Asia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. India Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 44. Australia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. Latin America Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. Latin America Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 47. Mexico Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 48. Brazil Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 49. Middle East & Africa Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 50. Middle East & Africa Semiconductor & IC Packaging Materials Market Share by Country (2019-2030)
Figure 51. Turkey Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 52. Saudi Arabia Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 53. UAE Semiconductor & IC Packaging Materials Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 54. Unimicron Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 55. Ibiden Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 56. Nan Ya PCB Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 57. Shinko Electric Industries Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 58. Kinsus Interconnect Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 59. AT&S Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 60. Samsung Electro-Mechanics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 61. Kyocera Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 62. Toppan Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 63. Zhen Ding Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 64. Daeduck Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 65. Zhuhai Access Semiconductor Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 66. LG InnoTek Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 67. Shennan Circuit Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 68. Shenzhen Fastprint Circuit Tech Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 69. Mitsui High-tec Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 70. Henkel Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 71. Chang Wah Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 72. Advanced Assembly Materials International Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 73. HAESUNG DS Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 74. Fusheng Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 75. Enomoto Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 76. Kangqiang Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 77. POSSEHL Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 78. JIH LIN TECHNOLOGY Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 79. Hualong Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 80. Dynacraft Industries Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 81. QPL Limited Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 82. WUXI HUAJING LEADFRAME Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 83. HUAYANG ELECTRONIC Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 84. DNP Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 85. Xiamen Jsun Precision Technology Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 86. Sumitomo Bakelite Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 87. Showa Denko Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 88. Chang Chun Group Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 89. Hysol Huawei Electronics Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 90. Panasonic Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 91. KCC Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 92. Eternal Materials Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 93. Jiangsu Zhongpeng New Material Revenue Growth Rate in Semiconductor & IC Packaging Materials Business (2019-2024)
Figure 94. Bottom-up and Top-down Approaches for This Report
Figure 95. Data Triangulation
Figure 96. Key Executives Interviewed
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