Electronics & Semiconductor
Global IC Packaging Substrate (SUB) Market Research Report 2024
- Aug 28, 24
- ID: 516373
- Pages: 129
- Figures: 252
- Views: 1
The global IC Packaging Substrate (SUB) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate (SUB), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate (SUB).
Report Scope
The IC Packaging Substrate (SUB) market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging Substrate (SUB) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate (SUB) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC
Segment by Type
Organic Substrate
Inorganic Substrate
Composite Substrate
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging Substrate (SUB) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging Substrate (SUB) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging Substrate (SUB) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate (SUB), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate (SUB).
Report Scope
The IC Packaging Substrate (SUB) market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global IC Packaging Substrate (SUB) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate (SUB) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
Ibiden
Shinko Electric Industries
AT&S
LG InnoTek
Fastprint Circuit Tech
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
Kinsus
SCC
Segment by Type
Organic Substrate
Inorganic Substrate
Composite Substrate
Segment by Application
Smart Phones
PC (Tablet, Laptop)
Wearable Devices
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of IC Packaging Substrate (SUB) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of IC Packaging Substrate (SUB) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of IC Packaging Substrate (SUB) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
1 IC Packaging Substrate (SUB) Market Overview
1.1 Product Definition
1.2 IC Packaging Substrate (SUB) Segment by Type
1.2.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Organic Substrate
1.2.3 Inorganic Substrate
1.2.4 Composite Substrate
1.3 IC Packaging Substrate (SUB) Segment by Application
1.3.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global IC Packaging Substrate (SUB) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts (2019-2030)
1.4.4 Global IC Packaging Substrate (SUB) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2019-2024)
2.2 Global IC Packaging Substrate (SUB) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of IC Packaging Substrate (SUB), Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Packaging Substrate (SUB) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of IC Packaging Substrate (SUB), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate (SUB), Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate (SUB), Date of Enter into This Industry
2.9 IC Packaging Substrate (SUB) Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate (SUB) Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate (SUB) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate (SUB) Production by Region
3.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global IC Packaging Substrate (SUB) Production Value by Region (2019-2030)
3.2.1 Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate (SUB) by Region (2025-2030)
3.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global IC Packaging Substrate (SUB) Production by Region (2019-2030)
3.4.1 Global IC Packaging Substrate (SUB) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of IC Packaging Substrate (SUB) by Region (2025-2030)
3.5 Global IC Packaging Substrate (SUB) Market Price Analysis by Region (2019-2024)
3.6 Global IC Packaging Substrate (SUB) Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
4 IC Packaging Substrate (SUB) Consumption by Region
4.1 Global IC Packaging Substrate (SUB) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global IC Packaging Substrate (SUB) Consumption by Region (2019-2030)
4.2.1 Global IC Packaging Substrate (SUB) Consumption by Region (2019-2024)
4.2.2 Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Packaging Substrate (SUB) Production by Type (2019-2030)
5.1.1 Global IC Packaging Substrate (SUB) Production by Type (2019-2024)
5.1.2 Global IC Packaging Substrate (SUB) Production by Type (2025-2030)
5.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Type (2019-2030)
5.2 Global IC Packaging Substrate (SUB) Production Value by Type (2019-2030)
5.2.1 Global IC Packaging Substrate (SUB) Production Value by Type (2019-2024)
5.2.2 Global IC Packaging Substrate (SUB) Production Value by Type (2025-2030)
5.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2019-2030)
5.3 Global IC Packaging Substrate (SUB) Price by Type (2019-2030)
6 Segment by Application
6.1 Global IC Packaging Substrate (SUB) Production by Application (2019-2030)
6.1.1 Global IC Packaging Substrate (SUB) Production by Application (2019-2024)
6.1.2 Global IC Packaging Substrate (SUB) Production by Application (2025-2030)
6.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Application (2019-2030)
6.2 Global IC Packaging Substrate (SUB) Production Value by Application (2019-2030)
6.2.1 Global IC Packaging Substrate (SUB) Production Value by Application (2019-2024)
6.2.2 Global IC Packaging Substrate (SUB) Production Value by Application (2025-2030)
6.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2019-2030)
6.3 Global IC Packaging Substrate (SUB) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Corporation Information
7.1.2 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product Portfolio
7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 MST
7.2.1 MST IC Packaging Substrate (SUB) Corporation Information
7.2.2 MST IC Packaging Substrate (SUB) Product Portfolio
7.2.3 MST IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 MST Main Business and Markets Served
7.2.5 MST Recent Developments/Updates
7.3 NGK
7.3.1 NGK IC Packaging Substrate (SUB) Corporation Information
7.3.2 NGK IC Packaging Substrate (SUB) Product Portfolio
7.3.3 NGK IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 NGK Main Business and Markets Served
7.3.5 NGK Recent Developments/Updates
7.4 KLA Corporation
7.4.1 KLA Corporation IC Packaging Substrate (SUB) Corporation Information
7.4.2 KLA Corporation IC Packaging Substrate (SUB) Product Portfolio
7.4.3 KLA Corporation IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 KLA Corporation Main Business and Markets Served
7.4.5 KLA Corporation Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic IC Packaging Substrate (SUB) Corporation Information
7.5.2 Panasonic IC Packaging Substrate (SUB) Product Portfolio
7.5.3 Panasonic IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate (SUB) Corporation Information
7.6.2 Simmtech IC Packaging Substrate (SUB) Product Portfolio
7.6.3 Simmtech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Daeduck
7.7.1 Daeduck IC Packaging Substrate (SUB) Corporation Information
7.7.2 Daeduck IC Packaging Substrate (SUB) Product Portfolio
7.7.3 Daeduck IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Daeduck Main Business and Markets Served
7.7.5 Daeduck Recent Developments/Updates
7.8 ASE Material
7.8.1 ASE Material IC Packaging Substrate (SUB) Corporation Information
7.8.2 ASE Material IC Packaging Substrate (SUB) Product Portfolio
7.8.3 ASE Material IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.8.4 ASE Material Main Business and Markets Served
7.7.5 ASE Material Recent Developments/Updates
7.9 Kyocera
7.9.1 Kyocera IC Packaging Substrate (SUB) Corporation Information
7.9.2 Kyocera IC Packaging Substrate (SUB) Product Portfolio
7.9.3 Kyocera IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Kyocera Main Business and Markets Served
7.9.5 Kyocera Recent Developments/Updates
7.10 Ibiden
7.10.1 Ibiden IC Packaging Substrate (SUB) Corporation Information
7.10.2 Ibiden IC Packaging Substrate (SUB) Product Portfolio
7.10.3 Ibiden IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Ibiden Main Business and Markets Served
7.10.5 Ibiden Recent Developments/Updates
7.11 Shinko Electric Industries
7.11.1 Shinko Electric Industries IC Packaging Substrate (SUB) Corporation Information
7.11.2 Shinko Electric Industries IC Packaging Substrate (SUB) Product Portfolio
7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Shinko Electric Industries Main Business and Markets Served
7.11.5 Shinko Electric Industries Recent Developments/Updates
7.12 AT&S
7.12.1 AT&S IC Packaging Substrate (SUB) Corporation Information
7.12.2 AT&S IC Packaging Substrate (SUB) Product Portfolio
7.12.3 AT&S IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.12.4 AT&S Main Business and Markets Served
7.12.5 AT&S Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Packaging Substrate (SUB) Corporation Information
7.13.2 LG InnoTek IC Packaging Substrate (SUB) Product Portfolio
7.13.3 LG InnoTek IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Fastprint Circuit Tech
7.14.1 Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
7.14.2 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product Portfolio
7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Fastprint Circuit Tech Main Business and Markets Served
7.14.5 Fastprint Circuit Tech Recent Developments/Updates
7.15 ACCESS
7.15.1 ACCESS IC Packaging Substrate (SUB) Corporation Information
7.15.2 ACCESS IC Packaging Substrate (SUB) Product Portfolio
7.15.3 ACCESS IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.15.4 ACCESS Main Business and Markets Served
7.15.5 ACCESS Recent Developments/Updates
7.16 Danbond Technology
7.16.1 Danbond Technology IC Packaging Substrate (SUB) Corporation Information
7.16.2 Danbond Technology IC Packaging Substrate (SUB) Product Portfolio
7.16.3 Danbond Technology IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Danbond Technology Main Business and Markets Served
7.16.5 Danbond Technology Recent Developments/Updates
7.17 TTM Technologies
7.17.1 TTM Technologies IC Packaging Substrate (SUB) Corporation Information
7.17.2 TTM Technologies IC Packaging Substrate (SUB) Product Portfolio
7.17.3 TTM Technologies IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.17.4 TTM Technologies Main Business and Markets Served
7.17.5 TTM Technologies Recent Developments/Updates
7.18 Unimicron
7.18.1 Unimicron IC Packaging Substrate (SUB) Corporation Information
7.18.2 Unimicron IC Packaging Substrate (SUB) Product Portfolio
7.18.3 Unimicron IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Unimicron Main Business and Markets Served
7.18.5 Unimicron Recent Developments/Updates
7.19 Nan Ya PCB
7.19.1 Nan Ya PCB IC Packaging Substrate (SUB) Corporation Information
7.19.2 Nan Ya PCB IC Packaging Substrate (SUB) Product Portfolio
7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.19.4 Nan Ya PCB Main Business and Markets Served
7.19.5 Nan Ya PCB Recent Developments/Updates
7.20 Kinsus
7.20.1 Kinsus IC Packaging Substrate (SUB) Corporation Information
7.20.2 Kinsus IC Packaging Substrate (SUB) Product Portfolio
7.20.3 Kinsus IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Kinsus Main Business and Markets Served
7.20.5 Kinsus Recent Developments/Updates
7.21 SCC
7.21.1 SCC IC Packaging Substrate (SUB) Corporation Information
7.21.2 SCC IC Packaging Substrate (SUB) Product Portfolio
7.21.3 SCC IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.21.4 SCC Main Business and Markets Served
7.21.5 SCC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate (SUB) Industry Chain Analysis
8.2 IC Packaging Substrate (SUB) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate (SUB) Production Mode & Process
8.4 IC Packaging Substrate (SUB) Sales and Marketing
8.4.1 IC Packaging Substrate (SUB) Sales Channels
8.4.2 IC Packaging Substrate (SUB) Distributors
8.5 IC Packaging Substrate (SUB) Customers
9 IC Packaging Substrate (SUB) Market Dynamics
9.1 IC Packaging Substrate (SUB) Industry Trends
9.2 IC Packaging Substrate (SUB) Market Drivers
9.3 IC Packaging Substrate (SUB) Market Challenges
9.4 IC Packaging Substrate (SUB) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
1.1 Product Definition
1.2 IC Packaging Substrate (SUB) Segment by Type
1.2.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Organic Substrate
1.2.3 Inorganic Substrate
1.2.4 Composite Substrate
1.3 IC Packaging Substrate (SUB) Segment by Application
1.3.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global IC Packaging Substrate (SUB) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts (2019-2030)
1.4.4 Global IC Packaging Substrate (SUB) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2019-2024)
2.2 Global IC Packaging Substrate (SUB) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of IC Packaging Substrate (SUB), Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global IC Packaging Substrate (SUB) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of IC Packaging Substrate (SUB), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate (SUB), Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate (SUB), Date of Enter into This Industry
2.9 IC Packaging Substrate (SUB) Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate (SUB) Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate (SUB) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate (SUB) Production by Region
3.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global IC Packaging Substrate (SUB) Production Value by Region (2019-2030)
3.2.1 Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate (SUB) by Region (2025-2030)
3.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global IC Packaging Substrate (SUB) Production by Region (2019-2030)
3.4.1 Global IC Packaging Substrate (SUB) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of IC Packaging Substrate (SUB) by Region (2025-2030)
3.5 Global IC Packaging Substrate (SUB) Market Price Analysis by Region (2019-2024)
3.6 Global IC Packaging Substrate (SUB) Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2019-2030)
4 IC Packaging Substrate (SUB) Consumption by Region
4.1 Global IC Packaging Substrate (SUB) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global IC Packaging Substrate (SUB) Consumption by Region (2019-2030)
4.2.1 Global IC Packaging Substrate (SUB) Consumption by Region (2019-2024)
4.2.2 Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global IC Packaging Substrate (SUB) Production by Type (2019-2030)
5.1.1 Global IC Packaging Substrate (SUB) Production by Type (2019-2024)
5.1.2 Global IC Packaging Substrate (SUB) Production by Type (2025-2030)
5.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Type (2019-2030)
5.2 Global IC Packaging Substrate (SUB) Production Value by Type (2019-2030)
5.2.1 Global IC Packaging Substrate (SUB) Production Value by Type (2019-2024)
5.2.2 Global IC Packaging Substrate (SUB) Production Value by Type (2025-2030)
5.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2019-2030)
5.3 Global IC Packaging Substrate (SUB) Price by Type (2019-2030)
6 Segment by Application
6.1 Global IC Packaging Substrate (SUB) Production by Application (2019-2030)
6.1.1 Global IC Packaging Substrate (SUB) Production by Application (2019-2024)
6.1.2 Global IC Packaging Substrate (SUB) Production by Application (2025-2030)
6.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Application (2019-2030)
6.2 Global IC Packaging Substrate (SUB) Production Value by Application (2019-2030)
6.2.1 Global IC Packaging Substrate (SUB) Production Value by Application (2019-2024)
6.2.2 Global IC Packaging Substrate (SUB) Production Value by Application (2025-2030)
6.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2019-2030)
6.3 Global IC Packaging Substrate (SUB) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Corporation Information
7.1.2 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product Portfolio
7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 MST
7.2.1 MST IC Packaging Substrate (SUB) Corporation Information
7.2.2 MST IC Packaging Substrate (SUB) Product Portfolio
7.2.3 MST IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 MST Main Business and Markets Served
7.2.5 MST Recent Developments/Updates
7.3 NGK
7.3.1 NGK IC Packaging Substrate (SUB) Corporation Information
7.3.2 NGK IC Packaging Substrate (SUB) Product Portfolio
7.3.3 NGK IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 NGK Main Business and Markets Served
7.3.5 NGK Recent Developments/Updates
7.4 KLA Corporation
7.4.1 KLA Corporation IC Packaging Substrate (SUB) Corporation Information
7.4.2 KLA Corporation IC Packaging Substrate (SUB) Product Portfolio
7.4.3 KLA Corporation IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 KLA Corporation Main Business and Markets Served
7.4.5 KLA Corporation Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic IC Packaging Substrate (SUB) Corporation Information
7.5.2 Panasonic IC Packaging Substrate (SUB) Product Portfolio
7.5.3 Panasonic IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate (SUB) Corporation Information
7.6.2 Simmtech IC Packaging Substrate (SUB) Product Portfolio
7.6.3 Simmtech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Daeduck
7.7.1 Daeduck IC Packaging Substrate (SUB) Corporation Information
7.7.2 Daeduck IC Packaging Substrate (SUB) Product Portfolio
7.7.3 Daeduck IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Daeduck Main Business and Markets Served
7.7.5 Daeduck Recent Developments/Updates
7.8 ASE Material
7.8.1 ASE Material IC Packaging Substrate (SUB) Corporation Information
7.8.2 ASE Material IC Packaging Substrate (SUB) Product Portfolio
7.8.3 ASE Material IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.8.4 ASE Material Main Business and Markets Served
7.7.5 ASE Material Recent Developments/Updates
7.9 Kyocera
7.9.1 Kyocera IC Packaging Substrate (SUB) Corporation Information
7.9.2 Kyocera IC Packaging Substrate (SUB) Product Portfolio
7.9.3 Kyocera IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Kyocera Main Business and Markets Served
7.9.5 Kyocera Recent Developments/Updates
7.10 Ibiden
7.10.1 Ibiden IC Packaging Substrate (SUB) Corporation Information
7.10.2 Ibiden IC Packaging Substrate (SUB) Product Portfolio
7.10.3 Ibiden IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Ibiden Main Business and Markets Served
7.10.5 Ibiden Recent Developments/Updates
7.11 Shinko Electric Industries
7.11.1 Shinko Electric Industries IC Packaging Substrate (SUB) Corporation Information
7.11.2 Shinko Electric Industries IC Packaging Substrate (SUB) Product Portfolio
7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Shinko Electric Industries Main Business and Markets Served
7.11.5 Shinko Electric Industries Recent Developments/Updates
7.12 AT&S
7.12.1 AT&S IC Packaging Substrate (SUB) Corporation Information
7.12.2 AT&S IC Packaging Substrate (SUB) Product Portfolio
7.12.3 AT&S IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.12.4 AT&S Main Business and Markets Served
7.12.5 AT&S Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Packaging Substrate (SUB) Corporation Information
7.13.2 LG InnoTek IC Packaging Substrate (SUB) Product Portfolio
7.13.3 LG InnoTek IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Fastprint Circuit Tech
7.14.1 Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
7.14.2 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product Portfolio
7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Fastprint Circuit Tech Main Business and Markets Served
7.14.5 Fastprint Circuit Tech Recent Developments/Updates
7.15 ACCESS
7.15.1 ACCESS IC Packaging Substrate (SUB) Corporation Information
7.15.2 ACCESS IC Packaging Substrate (SUB) Product Portfolio
7.15.3 ACCESS IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.15.4 ACCESS Main Business and Markets Served
7.15.5 ACCESS Recent Developments/Updates
7.16 Danbond Technology
7.16.1 Danbond Technology IC Packaging Substrate (SUB) Corporation Information
7.16.2 Danbond Technology IC Packaging Substrate (SUB) Product Portfolio
7.16.3 Danbond Technology IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Danbond Technology Main Business and Markets Served
7.16.5 Danbond Technology Recent Developments/Updates
7.17 TTM Technologies
7.17.1 TTM Technologies IC Packaging Substrate (SUB) Corporation Information
7.17.2 TTM Technologies IC Packaging Substrate (SUB) Product Portfolio
7.17.3 TTM Technologies IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.17.4 TTM Technologies Main Business and Markets Served
7.17.5 TTM Technologies Recent Developments/Updates
7.18 Unimicron
7.18.1 Unimicron IC Packaging Substrate (SUB) Corporation Information
7.18.2 Unimicron IC Packaging Substrate (SUB) Product Portfolio
7.18.3 Unimicron IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.18.4 Unimicron Main Business and Markets Served
7.18.5 Unimicron Recent Developments/Updates
7.19 Nan Ya PCB
7.19.1 Nan Ya PCB IC Packaging Substrate (SUB) Corporation Information
7.19.2 Nan Ya PCB IC Packaging Substrate (SUB) Product Portfolio
7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.19.4 Nan Ya PCB Main Business and Markets Served
7.19.5 Nan Ya PCB Recent Developments/Updates
7.20 Kinsus
7.20.1 Kinsus IC Packaging Substrate (SUB) Corporation Information
7.20.2 Kinsus IC Packaging Substrate (SUB) Product Portfolio
7.20.3 Kinsus IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.20.4 Kinsus Main Business and Markets Served
7.20.5 Kinsus Recent Developments/Updates
7.21 SCC
7.21.1 SCC IC Packaging Substrate (SUB) Corporation Information
7.21.2 SCC IC Packaging Substrate (SUB) Product Portfolio
7.21.3 SCC IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2019-2024)
7.21.4 SCC Main Business and Markets Served
7.21.5 SCC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate (SUB) Industry Chain Analysis
8.2 IC Packaging Substrate (SUB) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate (SUB) Production Mode & Process
8.4 IC Packaging Substrate (SUB) Sales and Marketing
8.4.1 IC Packaging Substrate (SUB) Sales Channels
8.4.2 IC Packaging Substrate (SUB) Distributors
8.5 IC Packaging Substrate (SUB) Customers
9 IC Packaging Substrate (SUB) Market Dynamics
9.1 IC Packaging Substrate (SUB) Industry Trends
9.2 IC Packaging Substrate (SUB) Market Drivers
9.3 IC Packaging Substrate (SUB) Market Challenges
9.4 IC Packaging Substrate (SUB) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
Table 1. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global IC Packaging Substrate (SUB) Production Capacity (M Pcs) by Manufacturers in 2023
Table 4. Global IC Packaging Substrate (SUB) Production by Manufacturers (2019-2024) & (M Pcs)
Table 5. Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2019-2024)
Table 6. Global IC Packaging Substrate (SUB) Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global IC Packaging Substrate (SUB) Production Value Share by Manufacturers (2019-2024)
Table 8. Global IC Packaging Substrate (SUB) Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in IC Packaging Substrate (SUB) as of 2023)
Table 10. Global Market IC Packaging Substrate (SUB) Average Price by Manufacturers (US$/Pc) & (2019-2024)
Table 11. Manufacturers IC Packaging Substrate (SUB) Production Sites and Area Served
Table 12. Manufacturers IC Packaging Substrate (SUB) Product Types
Table 13. Global IC Packaging Substrate (SUB) Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global IC Packaging Substrate (SUB) Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Region (2019-2024)
Table 17. Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2019-2024)
Table 18. Global IC Packaging Substrate (SUB) Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global IC Packaging Substrate (SUB) Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 21. Global IC Packaging Substrate (SUB) Production (M Pcs) by Region (2019-2024)
Table 22. Global IC Packaging Substrate (SUB) Production Market Share by Region (2019-2024)
Table 23. Global IC Packaging Substrate (SUB) Production (M Pcs) Forecast by Region (2025-2030)
Table 24. Global IC Packaging Substrate (SUB) Production Market Share Forecast by Region (2025-2030)
Table 25. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2019-2024)
Table 26. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2025-2030)
Table 27. Global IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 28. Global IC Packaging Substrate (SUB) Consumption by Region (2019-2024) & (M Pcs)
Table 29. Global IC Packaging Substrate (SUB) Consumption Market Share by Region (2019-2024)
Table 30. Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2025-2030) & (M Pcs)
Table 31. Global IC Packaging Substrate (SUB) Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 33. North America IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 34. North America IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 35. Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 36. Europe IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 37. Europe IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 38. Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 39. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2019-2024) & (M Pcs)
Table 40. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2025-2030) & (M Pcs)
Table 41. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 42. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 43. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 44. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2019-2024)
Table 45. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2025-2030)
Table 46. Global IC Packaging Substrate (SUB) Production Market Share by Type (2019-2024)
Table 47. Global IC Packaging Substrate (SUB) Production Market Share by Type (2025-2030)
Table 48. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2019-2024)
Table 49. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2025-2030)
Table 50. Global IC Packaging Substrate (SUB) Production Value Share by Type (2019-2024)
Table 51. Global IC Packaging Substrate (SUB) Production Value Share by Type (2025-2030)
Table 52. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2019-2024)
Table 53. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2025-2030)
Table 54. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2019-2024)
Table 55. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2025-2030)
Table 56. Global IC Packaging Substrate (SUB) Production Market Share by Application (2019-2024)
Table 57. Global IC Packaging Substrate (SUB) Production Market Share by Application (2025-2030)
Table 58. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2019-2024)
Table 59. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2025-2030)
Table 60. Global IC Packaging Substrate (SUB) Production Value Share by Application (2019-2024)
Table 61. Global IC Packaging Substrate (SUB) Production Value Share by Application (2025-2030)
Table 62. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2019-2024)
Table 63. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2025-2030)
Table 64. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Corporation Information
Table 65. Samsung Electro-Mechanics Specification and Application
Table 66. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 67. Samsung Electro-Mechanics Main Business and Markets Served
Table 68. Samsung Electro-Mechanics Recent Developments/Updates
Table 69. MST IC Packaging Substrate (SUB) Corporation Information
Table 70. MST Specification and Application
Table 71. MST IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 72. MST Main Business and Markets Served
Table 73. MST Recent Developments/Updates
Table 74. NGK IC Packaging Substrate (SUB) Corporation Information
Table 75. NGK Specification and Application
Table 76. NGK IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 77. NGK Main Business and Markets Served
Table 78. NGK Recent Developments/Updates
Table 79. KLA Corporation IC Packaging Substrate (SUB) Corporation Information
Table 80. KLA Corporation Specification and Application
Table 81. KLA Corporation IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 82. KLA Corporation Main Business and Markets Served
Table 83. KLA Corporation Recent Developments/Updates
Table 84. Panasonic IC Packaging Substrate (SUB) Corporation Information
Table 85. Panasonic Specification and Application
Table 86. Panasonic IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 87. Panasonic Main Business and Markets Served
Table 88. Panasonic Recent Developments/Updates
Table 89. Simmtech IC Packaging Substrate (SUB) Corporation Information
Table 90. Simmtech Specification and Application
Table 91. Simmtech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 92. Simmtech Main Business and Markets Served
Table 93. Simmtech Recent Developments/Updates
Table 94. Daeduck IC Packaging Substrate (SUB) Corporation Information
Table 95. Daeduck Specification and Application
Table 96. Daeduck IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 97. Daeduck Main Business and Markets Served
Table 98. Daeduck Recent Developments/Updates
Table 99. ASE Material IC Packaging Substrate (SUB) Corporation Information
Table 100. ASE Material Specification and Application
Table 101. ASE Material IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 102. ASE Material Main Business and Markets Served
Table 103. ASE Material Recent Developments/Updates
Table 104. Kyocera IC Packaging Substrate (SUB) Corporation Information
Table 105. Kyocera Specification and Application
Table 106. Kyocera IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 107. Kyocera Main Business and Markets Served
Table 108. Kyocera Recent Developments/Updates
Table 109. Ibiden IC Packaging Substrate (SUB) Corporation Information
Table 110. Ibiden Specification and Application
Table 111. Ibiden IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 112. Ibiden Main Business and Markets Served
Table 113. Ibiden Recent Developments/Updates
Table 114. Shinko Electric Industries IC Packaging Substrate (SUB) Corporation Information
Table 115. Shinko Electric Industries Specification and Application
Table 116. Shinko Electric Industries IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 117. Shinko Electric Industries Main Business and Markets Served
Table 118. Shinko Electric Industries Recent Developments/Updates
Table 119. AT&S IC Packaging Substrate (SUB) Corporation Information
Table 120. AT&S Specification and Application
Table 121. AT&S IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 122. AT&S Main Business and Markets Served
Table 123. AT&S Recent Developments/Updates
Table 124. LG InnoTek IC Packaging Substrate (SUB) Corporation Information
Table 125. LG InnoTek Specification and Application
Table 126. LG InnoTek IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 127. LG InnoTek Main Business and Markets Served
Table 128. LG InnoTek Recent Developments/Updates
Table 129. Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
Table 130. Fastprint Circuit Tech Specification and Application
Table 131. Fastprint Circuit Tech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 132. Fastprint Circuit Tech Main Business and Markets Served
Table 133. Fastprint Circuit Tech Recent Developments/Updates
Table 134. Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
Table 135. ACCESS Specification and Application
Table 136. ACCESS IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 137. ACCESS Main Business and Markets Served
Table 138. ACCESS Recent Developments/Updates
Table 139. Danbond Technology IC Packaging Substrate (SUB) Corporation Information
Table 140. Danbond Technology IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 141. Danbond Technology Main Business and Markets Served
Table 142. Danbond Technology Recent Developments/Updates
Table 143. TTM Technologies IC Packaging Substrate (SUB) Corporation Information
Table 144. TTM Technologies Specification and Application
Table 145. TTM Technologies IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 146. TTM Technologies Main Business and Markets Served
Table 147. TTM Technologies Recent Developments/Updates
Table 148. Unimicron IC Packaging Substrate (SUB) Corporation Information
Table 149. Unimicron Specification and Application
Table 150. Unimicron IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 151. Unimicron Main Business and Markets Served
Table 152. Unimicron Recent Developments/Updates
Table 153. Nan Ya PCB IC Packaging Substrate (SUB) Corporation Information
Table 154. Nan Ya PCB Specification and Application
Table 155. Nan Ya PCB IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 156. Nan Ya PCB Main Business and Markets Served
Table 157. Nan Ya PCB Recent Developments/Updates
Table 158. Kinsus IC Packaging Substrate (SUB) Corporation Information
Table 159. Kinsus Specification and Application
Table 160. Kinsus IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 161. Kinsus Main Business and Markets Served
Table 162. Kinsus Recent Developments/Updates
Table 163. SCC IC Packaging Substrate (SUB) Corporation Information
Table 164. SCC Specification and Application
Table 165. SCC IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 166. SCC Main Business and Markets Served
Table 167. SCC Recent Developments/Updates
Table 168. Key Raw Materials Lists
Table 169. Raw Materials Key Suppliers Lists
Table 170. IC Packaging Substrate (SUB) Distributors List
Table 171. IC Packaging Substrate (SUB) Customers List
Table 172. IC Packaging Substrate (SUB) Market Trends
Table 173. IC Packaging Substrate (SUB) Market Drivers
Table 174. IC Packaging Substrate (SUB) Market Challenges
Table 175. IC Packaging Substrate (SUB) Market Restraints
Table 176. Research Programs/Design for This Report
Table 177. Key Data Information from Secondary Sources
Table 178. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of IC Packaging Substrate (SUB)
Figure 2. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global IC Packaging Substrate (SUB) Market Share by Type: 2023 VS 2030
Figure 4. Organic Substrate Product Picture
Figure 5. Inorganic Substrate Product Picture
Figure 6. Composite Substrate Product Picture
Figure 7. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 8. Global IC Packaging Substrate (SUB) Market Share by Application: 2023 VS 2030
Figure 9. Smart Phones
Figure 10. PC (Tablet, Laptop)
Figure 11. Wearable Devices
Figure 12. Others
Figure 13. Global IC Packaging Substrate (SUB) Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global IC Packaging Substrate (SUB) Production Value (US$ Million) & (2019-2030)
Figure 15. Global IC Packaging Substrate (SUB) Production (M Pcs) & (2019-2030)
Figure 16. Global IC Packaging Substrate (SUB) Average Price (US$/Pc) & (2019-2030)
Figure 17. IC Packaging Substrate (SUB) Report Years Considered
Figure 18. IC Packaging Substrate (SUB) Production Share by Manufacturers in 2023
Figure 19. IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 20. The Global 5 and 10 Largest Players: Market Share by IC Packaging Substrate (SUB) Revenue in 2023
Figure 21. Global IC Packaging Substrate (SUB) Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 22. Global IC Packaging Substrate (SUB) Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2019 VS 2023 VS 2030 (M Pcs)
Figure 24. Global IC Packaging Substrate (SUB) Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. North America IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Europe IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. China IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Japan IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. South Korea IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global IC Packaging Substrate (SUB) Consumption by Region: 2019 VS 2023 VS 2030 (M Pcs)
Figure 31. Global IC Packaging Substrate (SUB) Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 33. North America IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 34. Canada IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 35. U.S. IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 36. Europe IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 37. Europe IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 38. Germany IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 39. France IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 40. U.K. IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 41. Italy IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 42. Russia IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 43. Asia Pacific IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 44. Asia Pacific IC Packaging Substrate (SUB) Consumption Market Share by Regions (2019-2030)
Figure 45. China IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 46. Japan IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 47. South Korea IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 48. China Taiwan IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 49. Southeast Asia IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 50. India IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 51. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 52. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 53. Mexico IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 54. Brazil IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 55. Turkey IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 56. GCC Countries IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 57. Global Production Market Share of IC Packaging Substrate (SUB) by Type (2019-2030)
Figure 58. Global Production Value Market Share of IC Packaging Substrate (SUB) by Type (2019-2030)
Figure 59. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2019-2030)
Figure 60. Global Production Market Share of IC Packaging Substrate (SUB) by Application (2019-2030)
Figure 61. Global Production Value Market Share of IC Packaging Substrate (SUB) by Application (2019-2030)
Figure 62. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2019-2030)
Figure 63. IC Packaging Substrate (SUB) Value Chain
Figure 64. IC Packaging Substrate (SUB) Production Process
Figure 65. Channels of Distribution (Direct Vs Distribution)
Figure 66. Distributors Profiles
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation
Table 1. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2023 VS 2030)
Table 2. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2023 VS 2030)
Table 3. Global IC Packaging Substrate (SUB) Production Capacity (M Pcs) by Manufacturers in 2023
Table 4. Global IC Packaging Substrate (SUB) Production by Manufacturers (2019-2024) & (M Pcs)
Table 5. Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2019-2024)
Table 6. Global IC Packaging Substrate (SUB) Production Value by Manufacturers (2019-2024) & (US$ Million)
Table 7. Global IC Packaging Substrate (SUB) Production Value Share by Manufacturers (2019-2024)
Table 8. Global IC Packaging Substrate (SUB) Industry Ranking 2022 VS 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in IC Packaging Substrate (SUB) as of 2023)
Table 10. Global Market IC Packaging Substrate (SUB) Average Price by Manufacturers (US$/Pc) & (2019-2024)
Table 11. Manufacturers IC Packaging Substrate (SUB) Production Sites and Area Served
Table 12. Manufacturers IC Packaging Substrate (SUB) Product Types
Table 13. Global IC Packaging Substrate (SUB) Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 14. Mergers & Acquisitions, Expansion
Table 15. Global IC Packaging Substrate (SUB) Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Table 16. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Region (2019-2024)
Table 17. Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2019-2024)
Table 18. Global IC Packaging Substrate (SUB) Production Value (US$ Million) Forecast by Region (2025-2030)
Table 19. Global IC Packaging Substrate (SUB) Production Value Market Share Forecast by Region (2025-2030)
Table 20. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 21. Global IC Packaging Substrate (SUB) Production (M Pcs) by Region (2019-2024)
Table 22. Global IC Packaging Substrate (SUB) Production Market Share by Region (2019-2024)
Table 23. Global IC Packaging Substrate (SUB) Production (M Pcs) Forecast by Region (2025-2030)
Table 24. Global IC Packaging Substrate (SUB) Production Market Share Forecast by Region (2025-2030)
Table 25. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2019-2024)
Table 26. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2025-2030)
Table 27. Global IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 28. Global IC Packaging Substrate (SUB) Consumption by Region (2019-2024) & (M Pcs)
Table 29. Global IC Packaging Substrate (SUB) Consumption Market Share by Region (2019-2024)
Table 30. Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2025-2030) & (M Pcs)
Table 31. Global IC Packaging Substrate (SUB) Forecasted Consumption Market Share by Region (2019-2024)
Table 32. North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 33. North America IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 34. North America IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 35. Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 36. Europe IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 37. Europe IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 38. Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (M Pcs)
Table 39. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2019-2024) & (M Pcs)
Table 40. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2025-2030) & (M Pcs)
Table 41. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (M Pcs)
Table 42. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2019-2024) & (M Pcs)
Table 43. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2025-2030) & (M Pcs)
Table 44. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2019-2024)
Table 45. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2025-2030)
Table 46. Global IC Packaging Substrate (SUB) Production Market Share by Type (2019-2024)
Table 47. Global IC Packaging Substrate (SUB) Production Market Share by Type (2025-2030)
Table 48. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2019-2024)
Table 49. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2025-2030)
Table 50. Global IC Packaging Substrate (SUB) Production Value Share by Type (2019-2024)
Table 51. Global IC Packaging Substrate (SUB) Production Value Share by Type (2025-2030)
Table 52. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2019-2024)
Table 53. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2025-2030)
Table 54. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2019-2024)
Table 55. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2025-2030)
Table 56. Global IC Packaging Substrate (SUB) Production Market Share by Application (2019-2024)
Table 57. Global IC Packaging Substrate (SUB) Production Market Share by Application (2025-2030)
Table 58. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2019-2024)
Table 59. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2025-2030)
Table 60. Global IC Packaging Substrate (SUB) Production Value Share by Application (2019-2024)
Table 61. Global IC Packaging Substrate (SUB) Production Value Share by Application (2025-2030)
Table 62. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2019-2024)
Table 63. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2025-2030)
Table 64. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Corporation Information
Table 65. Samsung Electro-Mechanics Specification and Application
Table 66. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 67. Samsung Electro-Mechanics Main Business and Markets Served
Table 68. Samsung Electro-Mechanics Recent Developments/Updates
Table 69. MST IC Packaging Substrate (SUB) Corporation Information
Table 70. MST Specification and Application
Table 71. MST IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 72. MST Main Business and Markets Served
Table 73. MST Recent Developments/Updates
Table 74. NGK IC Packaging Substrate (SUB) Corporation Information
Table 75. NGK Specification and Application
Table 76. NGK IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 77. NGK Main Business and Markets Served
Table 78. NGK Recent Developments/Updates
Table 79. KLA Corporation IC Packaging Substrate (SUB) Corporation Information
Table 80. KLA Corporation Specification and Application
Table 81. KLA Corporation IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 82. KLA Corporation Main Business and Markets Served
Table 83. KLA Corporation Recent Developments/Updates
Table 84. Panasonic IC Packaging Substrate (SUB) Corporation Information
Table 85. Panasonic Specification and Application
Table 86. Panasonic IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 87. Panasonic Main Business and Markets Served
Table 88. Panasonic Recent Developments/Updates
Table 89. Simmtech IC Packaging Substrate (SUB) Corporation Information
Table 90. Simmtech Specification and Application
Table 91. Simmtech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 92. Simmtech Main Business and Markets Served
Table 93. Simmtech Recent Developments/Updates
Table 94. Daeduck IC Packaging Substrate (SUB) Corporation Information
Table 95. Daeduck Specification and Application
Table 96. Daeduck IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 97. Daeduck Main Business and Markets Served
Table 98. Daeduck Recent Developments/Updates
Table 99. ASE Material IC Packaging Substrate (SUB) Corporation Information
Table 100. ASE Material Specification and Application
Table 101. ASE Material IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 102. ASE Material Main Business and Markets Served
Table 103. ASE Material Recent Developments/Updates
Table 104. Kyocera IC Packaging Substrate (SUB) Corporation Information
Table 105. Kyocera Specification and Application
Table 106. Kyocera IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 107. Kyocera Main Business and Markets Served
Table 108. Kyocera Recent Developments/Updates
Table 109. Ibiden IC Packaging Substrate (SUB) Corporation Information
Table 110. Ibiden Specification and Application
Table 111. Ibiden IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 112. Ibiden Main Business and Markets Served
Table 113. Ibiden Recent Developments/Updates
Table 114. Shinko Electric Industries IC Packaging Substrate (SUB) Corporation Information
Table 115. Shinko Electric Industries Specification and Application
Table 116. Shinko Electric Industries IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 117. Shinko Electric Industries Main Business and Markets Served
Table 118. Shinko Electric Industries Recent Developments/Updates
Table 119. AT&S IC Packaging Substrate (SUB) Corporation Information
Table 120. AT&S Specification and Application
Table 121. AT&S IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 122. AT&S Main Business and Markets Served
Table 123. AT&S Recent Developments/Updates
Table 124. LG InnoTek IC Packaging Substrate (SUB) Corporation Information
Table 125. LG InnoTek Specification and Application
Table 126. LG InnoTek IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 127. LG InnoTek Main Business and Markets Served
Table 128. LG InnoTek Recent Developments/Updates
Table 129. Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
Table 130. Fastprint Circuit Tech Specification and Application
Table 131. Fastprint Circuit Tech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 132. Fastprint Circuit Tech Main Business and Markets Served
Table 133. Fastprint Circuit Tech Recent Developments/Updates
Table 134. Fastprint Circuit Tech IC Packaging Substrate (SUB) Corporation Information
Table 135. ACCESS Specification and Application
Table 136. ACCESS IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 137. ACCESS Main Business and Markets Served
Table 138. ACCESS Recent Developments/Updates
Table 139. Danbond Technology IC Packaging Substrate (SUB) Corporation Information
Table 140. Danbond Technology IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 141. Danbond Technology Main Business and Markets Served
Table 142. Danbond Technology Recent Developments/Updates
Table 143. TTM Technologies IC Packaging Substrate (SUB) Corporation Information
Table 144. TTM Technologies Specification and Application
Table 145. TTM Technologies IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 146. TTM Technologies Main Business and Markets Served
Table 147. TTM Technologies Recent Developments/Updates
Table 148. Unimicron IC Packaging Substrate (SUB) Corporation Information
Table 149. Unimicron Specification and Application
Table 150. Unimicron IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 151. Unimicron Main Business and Markets Served
Table 152. Unimicron Recent Developments/Updates
Table 153. Nan Ya PCB IC Packaging Substrate (SUB) Corporation Information
Table 154. Nan Ya PCB Specification and Application
Table 155. Nan Ya PCB IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 156. Nan Ya PCB Main Business and Markets Served
Table 157. Nan Ya PCB Recent Developments/Updates
Table 158. Kinsus IC Packaging Substrate (SUB) Corporation Information
Table 159. Kinsus Specification and Application
Table 160. Kinsus IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 161. Kinsus Main Business and Markets Served
Table 162. Kinsus Recent Developments/Updates
Table 163. SCC IC Packaging Substrate (SUB) Corporation Information
Table 164. SCC Specification and Application
Table 165. SCC IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2019-2024)
Table 166. SCC Main Business and Markets Served
Table 167. SCC Recent Developments/Updates
Table 168. Key Raw Materials Lists
Table 169. Raw Materials Key Suppliers Lists
Table 170. IC Packaging Substrate (SUB) Distributors List
Table 171. IC Packaging Substrate (SUB) Customers List
Table 172. IC Packaging Substrate (SUB) Market Trends
Table 173. IC Packaging Substrate (SUB) Market Drivers
Table 174. IC Packaging Substrate (SUB) Market Challenges
Table 175. IC Packaging Substrate (SUB) Market Restraints
Table 176. Research Programs/Design for This Report
Table 177. Key Data Information from Secondary Sources
Table 178. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of IC Packaging Substrate (SUB)
Figure 2. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2023 VS 2030)
Figure 3. Global IC Packaging Substrate (SUB) Market Share by Type: 2023 VS 2030
Figure 4. Organic Substrate Product Picture
Figure 5. Inorganic Substrate Product Picture
Figure 6. Composite Substrate Product Picture
Figure 7. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2023 VS 2030)
Figure 8. Global IC Packaging Substrate (SUB) Market Share by Application: 2023 VS 2030
Figure 9. Smart Phones
Figure 10. PC (Tablet, Laptop)
Figure 11. Wearable Devices
Figure 12. Others
Figure 13. Global IC Packaging Substrate (SUB) Production Value (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global IC Packaging Substrate (SUB) Production Value (US$ Million) & (2019-2030)
Figure 15. Global IC Packaging Substrate (SUB) Production (M Pcs) & (2019-2030)
Figure 16. Global IC Packaging Substrate (SUB) Average Price (US$/Pc) & (2019-2030)
Figure 17. IC Packaging Substrate (SUB) Report Years Considered
Figure 18. IC Packaging Substrate (SUB) Production Share by Manufacturers in 2023
Figure 19. IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
Figure 20. The Global 5 and 10 Largest Players: Market Share by IC Packaging Substrate (SUB) Revenue in 2023
Figure 21. Global IC Packaging Substrate (SUB) Production Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
Figure 22. Global IC Packaging Substrate (SUB) Production Value Market Share by Region: 2019 VS 2023 VS 2030
Figure 23. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2019 VS 2023 VS 2030 (M Pcs)
Figure 24. Global IC Packaging Substrate (SUB) Production Market Share by Region: 2019 VS 2023 VS 2030
Figure 25. North America IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 26. Europe IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 27. China IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 28. Japan IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 29. South Korea IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2019-2030)
Figure 30. Global IC Packaging Substrate (SUB) Consumption by Region: 2019 VS 2023 VS 2030 (M Pcs)
Figure 31. Global IC Packaging Substrate (SUB) Consumption Market Share by Region: 2019 VS 2023 VS 2030
Figure 32. North America IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 33. North America IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 34. Canada IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 35. U.S. IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 36. Europe IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 37. Europe IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 38. Germany IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 39. France IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 40. U.K. IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 41. Italy IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 42. Russia IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 43. Asia Pacific IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 44. Asia Pacific IC Packaging Substrate (SUB) Consumption Market Share by Regions (2019-2030)
Figure 45. China IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 46. Japan IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 47. South Korea IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 48. China Taiwan IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 49. Southeast Asia IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 50. India IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 51. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 52. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Market Share by Country (2019-2030)
Figure 53. Mexico IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 54. Brazil IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 55. Turkey IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 56. GCC Countries IC Packaging Substrate (SUB) Consumption and Growth Rate (2019-2024) & (M Pcs)
Figure 57. Global Production Market Share of IC Packaging Substrate (SUB) by Type (2019-2030)
Figure 58. Global Production Value Market Share of IC Packaging Substrate (SUB) by Type (2019-2030)
Figure 59. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2019-2030)
Figure 60. Global Production Market Share of IC Packaging Substrate (SUB) by Application (2019-2030)
Figure 61. Global Production Value Market Share of IC Packaging Substrate (SUB) by Application (2019-2030)
Figure 62. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2019-2030)
Figure 63. IC Packaging Substrate (SUB) Value Chain
Figure 64. IC Packaging Substrate (SUB) Production Process
Figure 65. Channels of Distribution (Direct Vs Distribution)
Figure 66. Distributors Profiles
Figure 67. Bottom-up and Top-down Approaches for This Report
Figure 68. Data Triangulation
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