According to HengCe’s new survey, global L-FEM RF Chip market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key manufacturers engaged in the L-FEM RF Chip industry include Skyworks, Murata, Qualcomm, Qorvo, Broadcom, MAXSCEND, SMARTER MICRO, VANCHIP and UNISOC, etc. Among those manufacturers, the top 3 players...
DirectBond Copper (DBC) ceramic substrate is a new composite material that covers a highly insulating aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate with copper metal. After being heated in a high-temperature environment of 1065~1085°C, the copper metal is oxidized and diffused at high temperature to produce a eutectic melt with the ceramic, bonding the copper to the ceramic su...
Data center backup power is a key facility to ensure data center uptime and availability. After a power outage occurs, the backup power supply can ensure continuous power supply to the equipment and ensure the normal operation of the equipment. The traditional backup power supply is mainly UPS. Nowadays, a new power backup method-flywheel power supply has been added. On the basis of these two back...
Mini-LED belong to the LED TV family, which includes regular LED TVs and QLED TVs. A Mini-LED display uses the same formula as these other TVs — an LED backlight provides the primary source of brightness which then passes through an LCD matrix and a set of color filters to give us the final on-screen image.
According to HengCe’s new survey, global TV Mini-LED market is projected to reach US$ mill...
Uncooled vanadium oxide (VOx) infrared detectors are devices used in thermal imaging applications to detect infrared radiation emitted by objects. Unlike cooled infrared detectors that require cooling systems like cryogenic cooling to operate, uncooled detectors operate at or near room temperature without the need for additional cooling.
VOx is a material known for its temperature-sensitive elect...
Based on polished wafers, epitaxial wafers feature additional deposited monocrystalline surface layers. They are essential for the manufacturing of highly integrated semiconductor Elements (ICs), image sensors (CIS), and certain power semiconductors like high electron mobility transistors (HEMT).
According to HengCe’s new survey, global HEMT Epiwafer market is projected to reach US$ million in 20...
According to HengCe’s new survey, global 8-inch and 12-inch Wafer CMP Equipment market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key manufacturers engaged in the 8-inch and 12-inch Wafer CMP Equipment industry include Applied Materials, EBARA, KC Tech, ACCRETECH, Hwatsing Technology, Beijing Semicore Micro...
According to HengCe’s new survey, global Microwave and RF Solid State Power Amplifier (SSPA) for Defence market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key manufacturers engaged in the Microwave and RF Solid State Power Amplifier (SSPA) for Defence industry include Beverly Microwave Division (CPI BMD), T...
According to HengCe’s new survey, global High Power SSPAs Serve Commercial and Defense Applications market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key manufacturers engaged in the High Power SSPAs Serve Commercial and Defense Applications industry include Beverly Microwave Division (CPI BMD), Thales Alen...
According to HengCe’s new survey, global High Speed Operational Amplifiers for Automotive market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Key manufacturers engaged in the High Speed Operational Amplifiers for Automotive industry include Analog Devices Inc., Texas Instruments, Renesas Electronics, STM, ROH...
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